Semiconductor Driver Circuit Temperature Compensation
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Solution Overview
Problem
Conventional semiconductor switching element driver circuits fail to accurately reflect temperature information from both the driver circuit and the semiconductor switching element, leading to inefficiencies in operation and potential overheating issues due to differences in temperature characteristics and heat generation.
Innovation Solution
Incorporating temperature detection means within the driver circuit to adjust the drive signal edges and drive current capability based on temperature detection signals from both the driver circuit and the semiconductor switching element, thereby reducing the difference between on and off transmission delay times and optimizing circuit operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single temperature sensor is used for overheat protection, then the protection function is achieved, but the temperature information reflection is not fine enough
Solution Approach 1:
The temperature detection function is segmented into two independent sensors: one for the driver circuit temperature and another for the semiconductor switching element temperature. This allows each sensor to independently monitor its respective temperature, providing finer temperature information reflection without requiring a single complex sensing system.
Solution Approach 2:
The temperature monitoring is extended from a single-point measurement to a multi-dimensional approach by adding spatial separation between the two temperature sensors. This enables independent temperature control and monitoring in different thermal zones, achieving finer temperature information reflection.
2Adaptability or versatility
If the driver circuit and semiconductor switching element are cooled together, then the overall temperature is reduced, but the temperature difference between them is not utilized
Solution Approach 1:
The temperature difference between the driver circuit and semiconductor switching element is fed back to the control circuit, which adjusts the drive signal edges based on this differential information. This feedback mechanism enables abnormality detection by monitoring deviations from normal temperature differences, enhancing productivity through improved detection capability.
Solution Approach 2:
The control circuit acts as an intermediary that processes temperature information from both sensors and generates adjusted drive signals. This intermediary function utilizes the temperature difference to optimize switching element performance and detect abnormalities, making the temperature difference information actionable.
3Reliability
If the on edge and off edge delays are not adjusted, then the circuit structure is simple, but the temperature characteristic influence is not compensated
Solution Approach 1:
The drive signal edges are made dynamic by adjusting their timing based on real-time temperature information. The control circuit dynamically modifies the on edge and off edge delays according to the temperatures of the driver circuit and switching element, compensating for temperature characteristics and improving circuit operation accuracy.
Solution Approach 2:
The timing parameters of the drive signal edges are changed based on temperature conditions. The control circuit alters the delay times of the on edge and off edge in response to temperature variations, thereby compensating for temperature-induced performance changes in the switching element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more precise temperature information reflection in the driver circuit operations, enhancing the accuracy and efficiency of semiconductor device performance by adjusting for temperature differences and characteristics.
Implementation Method 1
an element temperature sensor element which senses the temperature of the semiconductor switching element
Implementation Method 2
at least one of the on edge and the off edge is delayed on the basis of at least one of the first temperature detection signal and the second temperature detection signal so that the difference between an on transmission delay time and an off transmission delay time is reduced
Data Source
AI summary
A driver circuit (101) is connected to a control terminal of a semiconductor switching element (1). The driver circuit (101) includes an input circuit (3) connected to an input terminal (50), and an output control circuit (4) connected to the input circuit (3). A pulse signal output from the output control circuit (4) is input to a dead time adjustment circuit (13). The dead time adjustment circuit (13) includes a delay circuit which can delay the rising edge and the falling edge of the pulse signal output from the output control circuit (4) on the basis of signals from temperature analog output circuits (11) and (12). An output from the dead time adjustment circuit (13) is input to the drive circuit (5). The drive circuit (5) outputs a drive signal to an output terminal (51) of the driver circuit (101).