Semiconductor Package Dual Encapsulant Integration

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Solution Overview

Problem

The existing semiconductor device packages with integrated light emitting and photo detecting components are complex and costly to manufacture due to the need for multiple carriers, resulting in increased thickness and complexity.

Innovation Solution

A semiconductor device package design that integrates light emitting and photo detecting components directly on a substrate with a dual encapsulant system, where a first encapsulant covers the optical region and a second encapsulant covers the SMT device region, reducing the need for additional carriers and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the light emitter and photo detector are disposed on a carrier to form an optical module and then integrated with electronic components on another carrier, then the functional integration is achieved, but the manufacturing complexity and cost increase, and the package thickness increases

Engineering Contradiction:

Improvefunctional integrationVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the optical module components (light emitter and photo detector) and electronic components onto a single substrate, eliminating the need for separate carriers. This consolidation reduces manufacturing complexity and package thickness while maintaining full functional integration, directly resolving the technical contradiction between adaptability and device complexity.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

Engineering Contradiction:

Improvefunctional integrationVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent consolidates all components onto a single substrate, reducing the number of manufacturing steps, materials required, and assembly operations. This merging approach lowers material costs, reduces labor and equipment requirements, and simplifies the overall manufacturing process while achieving complete functional integration.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

Engineering Contradiction:

Improvefunctional integrationVSAvoidpackage thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent integrates all optical and electronic components onto a single substrate in a planar configuration, eliminating the need for stacked or multi-layer carrier structures. This merging approach significantly reduces the vertical dimension and package thickness while maintaining complete functional integration of all components.

Inventive Principle:

Principle #5Merging (Combining)

4Object-affected harmful factors

If a dual encapsulant system is used to cover the optical and SMT device regions separately, then light interference between components is prevented, but the manufacturing process complexity increases

Engineering Contradiction:

Improvelight interferenceVSAvoidencapsulation structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent divides the encapsulation into two distinct portions: a first encapsulant for the optical region and a second encapsulant for the SMT device region. This segmentation allows each encapsulant to be optimized for its specific function (light transmission for optical components, light blocking for electronic components) while preventing harmful light interference between regions.

Inventive Principle:

Principle #1Segmentation

5Object-affected harmful factors

If a dual encapsulant system is used to cover the optical and SMT device regions separately, then light interference between components is prevented, but the manufacturing cost increases

Engineering Contradiction:

Improvelight interferenceVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent implements segmentation of the encapsulation process into two distinct steps with two different encapsulant materials. The first encapsulant is applied to cover optical components with light transmission requirements, while the second encapsulant covers SMT devices to block light. This segmented approach prevents light interference while using cost-effective materials and processes for each specific application.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11557684B2Semiconductor device package and method of manufacturing the same

Publication Date: 2023.01.17 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a substrate, a first encapsulant and a second encapsulant. The substrate has an optical region and a surface-mount technology (SMT) device region. The first encapsulant includes a first portion disposed on the optical region and covers the optical region and a second portion disposed on the SMT device region and covers the SMT device region. The second encapsulant is disposed on the substrate and covers at least a portion of the second portion of the first encapsulant and a portion of the first portion of the first encapsulant.