Semiconductor Pad Arrangement for Chip Size Reduction
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Solution Overview
Problem
The existing arrangement of pads in semiconductor devices, particularly in those with a large number of pads relative to circuit scale, leads to increased chip size and complex wiring layouts due to the need for dual-function pads that accommodate both probing and bonding, resulting in inefficient use of space and increased dimensions.
Innovation Solution
The arrangement of pads is optimized by placing dual-function pads with longer sides perpendicular to the pad arrangement direction, allowing for a reduced row length without increasing chip size, and grouping pads to simplify wiring layouts, ensuring that first group pads have equal lengths and second group pads have greater lengths, thereby preventing unnecessary space and complexity in wiring patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If dual-function pads are made larger to accommodate both probing and bonding, then the pad area increases, but the chip size increases along the arrangement direction
Solution Approach 1:
The patent changes the orientation of the longer side of dual-function pads from parallel to perpendicular relative to the pad arrangement direction. This dimensional reorientation allows the extended length to be utilized in the perpendicular dimension rather than extending the row length, thereby accommodating both probing and bonding functions without increasing chip size along the arrangement direction.
2Length of stationary object
If dual-function pads are placed with longer sides perpendicular to pad arrangement direction, then row length is reduced, but wiring layout becomes complicated
Solution Approach 1:
The patent applies different pad configurations to different functional groups: first group pads maintain a standard configuration, while second group pads (dual-function pads) use an extended configuration with longer sides perpendicular to the arrangement direction. This localized differentiation allows the extended pads to be positioned at specific locations where they can be effectively connected to circuit elements without complicating the overall wiring layout.
3Length of stationary object
If dual-function pads are arranged with different lengths in perpendicular direction, then chip size must be increased, but space efficiency is reduced
Solution Approach 1:
Instead of extending dual-function pads in the same direction as the pad arrangement (which would increase row length), the patent inverts the approach by extending them in the perpendicular direction. This inversion allows the extended length to be accommodated within the existing chip boundaries without increasing the overall chip size, thereby maintaining space efficiency.
Data Source
AI summary
A device comprises a semiconductor chip including an edge elongated in a first direction. A plurality of first pads is formed on the semiconductor chip. The first pads are substantially equal in length in the first direction to each other. A second pad is formed on the semiconductor chip. The second pad is greater in length in the first direction than the first pads. The first pads and the second pad are arranged in a line elongated in the second direction, that is substantially perpendicular to the first direction, without an intervention of any one of the first pads between the second pad and the edge.