Semiconductor Device Dual-Sided Cooling Integration
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Solution Overview
Problem
Existing semiconductor devices face limitations due to heat generation, which complicates their structure and increases size due to the need for internal wiring and efficient cooling, thereby reducing current and power density.
Innovation Solution
A semiconductor device with reverse conducting semiconductor switches featuring dual-sided cooling using electrically conductive cooling elements that also serve as electrical connections, simplifying internal wiring and enabling efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate cooling elements and internal wiring are used for cooling and electrical connections, then cooling efficiency is improved, but device complexity and size increase
Solution Approach 1:
The patent combines the cooling function and electrical connection function into a single integrated component. The cooling element is made electrically conductive and directly contacts the semiconductor element electrodes, eliminating the need for separate internal wiring. This merging of functions reduces structural complexity while maintaining effective cooling and electrical connection capabilities.
Solution Approach 2:
The cooling element is designed to perform multiple functions simultaneously: it acts as both a thermal management component (cooling the semiconductor element) and an electrical connection component (providing electrical pathway). This multi-functionality reduces the number of separate components needed and simplifies the overall device structure.
2Temperature
If separate cooling elements and internal wiring are used, then heat dissipation is improved, but device size increases
Solution Approach 1:
By merging the cooling element and electrical connection into a single component, the patent eliminates the additional space that would be required for separate internal wiring and multiple cooling elements. This integration reduces the overall device volume while maintaining effective heat dissipation capabilities.
Solution Approach 2:
The multi-functional cooling element that simultaneously provides thermal management and electrical connection reduces the total component count and space requirements. This approach allows efficient heat dissipation without proportionally increasing device size.
3Reliability
If multiple separate components are used for cooling and electrical connections, then functional performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple separate components (cooling element and electrical connection) into a single integrated component. This reduces the number of assembly steps, minimizes alignment requirements, and simplifies the manufacturing process while maintaining the functional performance of both cooling and electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, efficient semiconductor device with maximized current and power density by integrating cooling and electrical connections, reducing internal wiring complexity and enhancing heat management.
Implementation Method 1
a first cooling element in contact with the first electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements to the first cooling element
Implementation Method 2
The first cooling element is made of an electrically conductive material to electrically connect the first electrodes of the semiconductor elements to an external apparatus
Data Source
AI summary
A semiconductor device which provides a small and simple design with efficient cooling. A first electrically conducting cooling element is in contact with first electrodes of semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the first electrodes of the semiconductor elements to an external apparatus. A second electrically conducting cooling element is in contact with second electrodes of the semiconductor elements for forwarding a heat load from the semiconductor elements and for electrically connecting the second electrodes of the semiconductor elements to an external apparatus. The semiconductor device includes an interface which is electrically connected to gates of the semiconductor elements for external control of respective states of the semiconductor elements.