Semiconductor Device Dual-Sided Heat Dissipation Shielding Plate
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Solution Overview
Problem
Semiconductor devices face challenges in reducing radiation noise influence and improving heat dissipation while minimizing size, as existing solutions often insufficiently address heat dissipation from a single side of the semiconductor element.
Innovation Solution
A semiconductor device design featuring a semiconductor element with a metal plate thermally connected to its lower surface, an insulating sheet with high heat conductivity on the upper surface electrode, and a shielding plate for radiation noise shielding, all encapsulated in resin with the shielding plate and metal plate exposed to enhance heat dissipation and noise shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is enabled only from one side of the semiconductor element by contacting the electrically conductive layer with the island, then the device structure is simple, but the heat dissipation ability is insufficient
Solution Approach 1:
The invention divides the heat dissipation function into two separate paths: one through the lower surface via the electrically conductive layer contacting the island, and another through the upper surface via the shielding plate contacting the upper surface electrode. This segmentation allows heat to be dissipated from both sides of the semiconductor element simultaneously, significantly improving heat dissipation ability without creating a single complex heat dissipation structure
Solution Approach 2:
The shielding plate serves multiple functions: it provides electromagnetic wave shielding to protect the control circuit from radiation noise generated by the semiconductor element, and simultaneously acts as a heat dissipation path by contacting the upper surface electrode. This multi-functionality improves heat dissipation ability while avoiding the need for additional dedicated heat dissipation components that would increase device complexity
2Volume of moving object
If the semiconductor device size is reduced, then the compactness is improved, but the heat dissipation ability may be compromised
Solution Approach 1:
The invention transitions from single-sided heat dissipation to dual-sided heat dissipation by utilizing both the upper and lower surfaces of the semiconductor element. This dimensional change in heat dissipation architecture allows efficient heat removal from a compact device volume, maintaining small device size while significantly improving heat dissipation ability through the use of the third dimension (vertical heat flow from both top and bottom surfaces)
3Object-affected harmful factors
If the shielding plate is formed to shield against radiation noise, then the control circuit is protected from noise, but the device complexity increases
Solution Approach 1:
The shielding plate is designed to perform dual functions: electromagnetic wave shielding to protect the control circuit from radiation noise generated by the semiconductor element, and heat dissipation by contacting the upper surface electrode. This multi-functionality allows the device to achieve noise protection without adding dedicated heat dissipation components, thereby reducing overall device complexity while still providing comprehensive protection and thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides effective heat dissipation from both sides of the semiconductor element, reducing radiation noise influence and enabling a compact form factor with improved reliability and heat release capabilities.
Implementation Method 1
a metal plate which is thermally connected to the lower surface of the semiconductor element
Implementation Method 2
an insulating sheet which is formed on the upper surface electrode... the heat conductivity of the insulating sheet is higher than the heat conductivity of the resin
Implementation Method 3
a shielding plate which is formed on the insulating sheet... the shielding plate shielding against radiation noise
Data Source
AI summary
A semiconductor device of the present invention includes a semiconductor element having an upper surface and a lower surface, a metal plate thermally connected to the lower surface, an upper surface electrode soldered to the upper surface, an insulating sheet formed on the upper surface electrode so as to be in surface contact with the upper surface electrode, a shielding plate formed on the insulating sheet so as to be in surface contact with the insulating sheet, the shielding plate shielding against radiation noise, and a resin with which the semiconductor element is covered, while a portion of the upper surface electrode, a portion of the shielding plate and a lower surface of the metal plate are exposed to the outside, wherein the heat conductivity of the insulating sheet is higher than the heat conductivity of the resin.