Semiconductor Package Dummy Bump Heat Dissipation
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Solution Overview
Problem
In semiconductor packages, the conductive bumps used for electrical and thermal connections face challenges in efficiently dissipating heat due to their limited design, which restricts their ability to effectively transfer heat generated by the semiconductor chip.
Innovation Solution
The semiconductor package design incorporates a redistribution structure with a narrower redistribution pattern and a dummy bump on the passivation layer, where the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern, providing additional heat dissipation paths without obstructing the electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive bumps are formed only on exposed pads and not on circuit patterns, then electrical connection reliability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The invention segments the bump structure into two distinct types: connection bumps formed on exposed pads for reliable electrical connection, and dummy bumps formed on circuit patterns for heat dissipation. This segmentation allows each type to fulfill its specific function without compromising the other, resolving the contradiction between electrical reliability and thermal management.
Solution Approach 2:
The invention applies local quality by giving different regions of the substrate different functionalities: exposed pads receive connection bumps with electrical connection properties, while circuit patterns receive dummy bumps with thermal conduction properties. This localized differentiation enables simultaneous optimization of electrical connection reliability and heat dissipation capability across different areas of the package.
2Temperature
If additional heat dissipation paths are created by adding dummy bumps, then thermal management is improved, but device complexity increases
Solution Approach 1:
The dummy bumps serve multiple functions: they provide heat dissipation pathways, maintain structural symmetry in the package, and can potentially serve as future connection points. This multi-functionality justifies the added structural elements and reduces the perceived complexity by demonstrating that additional components serve multiple purposes beyond simple heat dissipation.
Solution Approach 2:
The dummy bumps are essentially copies of the connection bump structure, using the same materials and formation processes. This copying approach simplifies manufacturing by reusing existing processes and materials, thereby reducing the actual complexity despite the increased number of components. The dummy bumps replicate the thermal conduction properties of connection bumps without requiring new technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance by creating additional thermal paths while maintaining electrical connectivity, thereby improving the overall thermal management of the semiconductor package.
Implementation Method 1
a conductive bump below a redistribution structure may be used to provide an electrical path for electrically connecting the package and a mounting substrate and a thermal path for transferring heat generated from a semiconductor chip externally
Data Source
AI summary
A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.