Semiconductor Device Dummy Chip Laser Marking Protection
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Solution Overview
Problem
The thinning of resin material in semiconductor packages poses a risk of damage to semiconductor chips and bonding wires during laser marking, as the laser intensity can cause damage to the resin material, potentially harming the underlying components.
Innovation Solution
Incorporating a dummy chip with a thickness smaller than the semiconductor chips, which covers the surface and protrudes over the bonding wires, providing protection from laser marking damage and maintaining electrical insulation through a silicon dioxide film and adhesive layer, while also acting as a heat spreader to reduce package warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the resin material thickness is reduced to downscale and thin the semiconductor package, then the package size is reduced, but the semiconductor chip and bonding wires are at risk of damage from laser marking
Solution Approach 1:
A dummy chip is introduced as an intermediary protective layer between the laser marking process and the semiconductor chip. The dummy chip absorbs the laser impact and prevents direct damage to the bonding wires and semiconductor chip, while allowing the resin layer to be kept thin for package downsizing.
Solution Approach 2:
The dummy chip is positioned beforehand to cover the bonding wires and protrude over them, creating a protective cushion that absorbs laser marking damage before it can reach the semiconductor chip. This preliminary protection structure enables thin resin packaging without compromising component safety.
2Reliability
If a dummy chip is added to protect against laser marking damage, then the reliability is improved, but the device structure becomes more complex
Solution Approach 1:
The dummy chip serves multiple functions simultaneously: it protects bonding wires from laser damage, acts as a heat spreader to improve thermal management, and provides mechanical support. This multi-functionality justifies the additional component by delivering multiple benefits from a single structural addition.
Solution Approach 2:
The dummy chip is designed with specific parameter optimizations: its thickness is controlled to be smaller than the semiconductor chip to minimize added height, its material composition is selected for thermal conduction properties, and its surface area is optimized to cover bonding wires while protruding appropriately. These parameter adjustments balance protection needs with structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dummy chip effectively suppresses damage to semiconductor chips and bonding wires during laser marking, enhances the reliability of the semiconductor device, and allows for thinner resin layers without increasing the overall package thickness, while maintaining electrical insulation and potentially acting as a heat spreader.
Implementation Method 1
maintaining electrical insulation through a silicon dioxide film
Implementation Method 2
acting as a heat spreader to reduce package warpage
Implementation Method 3
The laser marking damages the resin material to a certain depth from the surface of the resin material depending on the laser intensity
Data Source
AI summary
A semiconductor device according to the present embodiment includes a wiring substrate having a wiring layer. A first semiconductor chip is provided above the wiring substrate. A metallic wire connects the first semiconductor chip and the wiring substrate to each other. A silicon chip is provided above the first semiconductor chip and covers above the metallic wire. A resin layer seals the first semiconductor chip and the silicon chip, and the metallic wire. The silicon chip is insulated from the wiring substrate.