Semiconductor Package Layout Using Dummy Dies for Warpage Control
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Solution Overview
Problem
The integration of multiple semiconductor devices into miniaturized, high-speed electronic apparatus poses challenges due to warpage issues during manufacturing, which can reduce manufacturing yield and increase costs, especially in 3D packaging and 3DIC devices.
Innovation Solution
The use of a semiconductor package structure with a central region and a peripheral region, where functional semiconductor dies are placed in the central region and dummy dies are strategically distributed in the peripheral region to control warpage, achieved by optimizing the vacancy ratios of these regions through careful disposition and sizing of dummy dies, thereby reducing thermal expansion discrepancies and maintaining electrical connectivity via a redistribution structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are integrated into miniaturized packages, then device density and performance are improved, but warpage issues occur during manufacturing reducing yield
Solution Approach 1:
The patent applies local quality by distributing dummy dies non-uniformly across the package substrate, with higher density in peripheral regions and lower density near the center. This creates spatially varying mechanical compensation that locally counteracts warpage forces generated during manufacturing processes, enabling high device integration while maintaining flatness and manufacturing yield.
Solution Approach 2:
The patent uses dummy dies as counterweight elements to compensate for warpage. These non-functional dies are strategically positioned and sized to create opposing mechanical forces that balance the warpage-induced stresses, effectively canceling out the deformation and maintaining manufacturing precision despite high device density integration.
2Manufacturing precision
If dummy dies are added to control warpage, then manufacturing yield is improved, but package area and complexity increase
Solution Approach 1:
The dummy dies serve multiple functions simultaneously: they act as mechanical counterweights to control warpage, serve as structural support elements during manufacturing, and can be integrated with the redistribution layer structure. This multi-functionality allows warpage control without proportionally increasing package complexity, as the same elements perform multiple roles in the package architecture.
Solution Approach 2:
The patent optimizes warpage control by adjusting parameters of the dummy dies including their size, shape, material composition, and spatial distribution pattern. By varying these parameters, the system achieves effective warpage compensation with minimal dummy die count and footprint, thereby controlling package complexity while maintaining manufacturing precision.
3Manufacturing precision
If vacancy ratios are optimized to minimize warpage, then manufacturing yield is enhanced, but redistribution structure design becomes more challenging
Solution Approach 1:
The patent implements preliminary action by pre-calculating and pre-positioning dummy dies with specific vacancy ratios before the redistribution layer is formed. This advance planning and positioning of mechanical compensation elements simplifies subsequent redistribution layer design, as the warpage control framework is already established, reducing overall design complexity despite the optimization requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes warpage, enhances manufacturing yield, and ensures reliable electrical connections, allowing for the integration of multiple semiconductor devices into compact, high-performance electronic packages without costly redesigns of the redistribution structure.
Implementation Method 1
optimizing the vacancy ratios of these regions through careful disposition and sizing of dummy dies, thereby reducing thermal expansion discrepancies
Data Source
AI summary
A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.