Thermally Dissipating Dummy Pads for Semiconductor Heat Management
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Solution Overview
Problem
High-integration semiconductor devices require effective heat dissipation without compromising integration density or complicating the manufacturing process, as existing stacked structures often rely on heat dissipating sheets and sinks that lower integration density and complicate manufacturing.
Innovation Solution
Incorporating dummy pads on the semiconductor substrate that are not electrically coupled to conductive pads, used for heat dispersion, connected by lines, and penetrating electrodes to efficiently distribute heat generated by the circuit structure, allowing for even heat distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipating sheets and heat sinks are used to discharge heat, then heat dissipation is improved, but integration density is lowered and manufacturing process becomes complicated
Solution Approach 1:
The patent merges the heat dissipation function with the existing pad structure by forming dummy pads simultaneously with conductive pads during the same manufacturing process. This integration eliminates the need for separate heat dissipating sheets and heat sinks, thereby simplifying the manufacturing process while maintaining effective heat dissipation through the integrated dummy pads that are electrically isolated but thermally coupled to the circuit board.
2Temperature
If heat dissipating sheets and heat sinks are used to discharge heat, then heat dissipation is improved, but integration density is lowered
Solution Approach 1:
The patent combines the heat dissipation function with the existing pad structure by forming dummy pads simultaneously with conductive pads during the same manufacturing process. This integration eliminates the need for separate heat dissipating sheets and heat sinks, thereby simplifying the manufacturing process while maintaining effective heat dissipation through the integrated dummy pads that are electrically isolated but thermally coupled to the circuit board.
3Temperature
If dummy pads are formed on the semiconductor substrate, then heat spreading efficiency is enhanced, but device structure becomes more complex
Solution Approach 1:
The patent creates dummy pads that are structurally similar to conductive pads but electrically isolated, copying the thermal conduction pathway without the electrical connection function. This allows the dummy pads to effectively spread heat across the circuit board while maintaining a simple structure that integrates seamlessly with the existing pad layout, avoiding additional structural complexity.
4Temperature
If dummy pads are used for heat dispersion, then hot-spot formation is prevented, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms dummy pads simultaneously with conductive pads during the same manufacturing process step, performing the heat dissipation structure preparation in advance rather than as a separate post-processing step. This preliminary action ensures that both pad types are created with identical precision standards, eliminating the need for additional precision requirements while effectively preventing hot-spot formation through the integrated dummy pad network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat spreading efficiency, prevents hot-spot formation, improves reliability and stability of semiconductor devices, simplifies manufacturing by eliminating the need for external heat dissipating components, and maintains product characteristics under high temperatures.
Implementation Method 1
The at least one dummy pad is not electrically coupled to the at least one conductive pad and may be used to disperse heat
Data Source
AI summary
A semiconductor device capable of improving the efficiency of dispersing heat via a dummy pad. The semiconductor device may be included in a semiconductor package, stack module, card, or system. Also disclosed is a method of manufacturing the semiconductor device. In the semiconductor device, a semiconductor substrate has a first surface and a second surface opposite to the first surface, and at least one conductive pad is arranged on a predetermined region of the first surface. At least one dummy pad is arranged on the first or second surface, and is not electrically coupled to the at least one conductive pad. The dummy pad or pads may be used to disperse heat. Accordingly, it is possible to increase the efficiency of dispersing heat of a semiconductor device, thereby improving the yield of semiconductor devices.