Semiconductor DUT Test System With Independent Signal Paths
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Solution Overview
Problem
The increasing complexity of semiconductor device testing in miniaturized and multi-functional electronic products necessitates a test device and system that can handle multiple devices under test (DUTs) efficiently, with improved signal characteristics.
Innovation Solution
A test device and system featuring independent electrical paths for input and output signals on DUT boards, with separate connectors and transmission lines for each signal, allowing for enhanced signal characteristics and reduced signal stubs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are simultaneously tested as DUTs, then testing capacity and productivity are improved, but signal interference and test accuracy deteriorate
Solution Approach 1:
The patent divides the signal transmission paths into separate segments for input and output signals. Each DUT board has dedicated input transmission lines and output transmission lines that are physically separated and electrically independent, preventing signal interference while enabling simultaneous testing of multiple devices.
Solution Approach 2:
The patent extracts the output signal transmission path from the input signal path by using separate transmission lines. The output signal from each DUT is transmitted through dedicated output transmission lines to adjacent DUT boards, rather than sharing the input transmission lines, thereby eliminating signal interference.
2Measurement precision
If separate transmission lines are used for input and output signals, then signal characteristics and test accuracy are improved, but device complexity increases
Solution Approach 1:
The patent merges the transmission line structures across multiple DUT boards to form a unified testing system. The output transmission lines of one DUT board are connected to the input transmission lines of adjacent DUT boards, creating an integrated signal transmission network that reduces overall system complexity while maintaining signal integrity.
Solution Approach 2:
The transmission lines are designed to serve multiple functions: input transmission lines receive signals for multiple DUTs, while output transmission lines transmit signals to adjacent DUT boards. This multi-functionality reduces the need for dedicated separate paths for each signal type, thereby reducing device complexity.
Data Source
AI summary
A test device includes a main board. First and second device under test (DUT) boards are disposed on the main board. First and second semiconductor devices are mounted on the first and second DUT boards, respectively. The first and second semiconductor devices are DUTs. First and second connectors are respectively disposed at a first end and a second end of the first DUT board. The first and second connectors are spaced apart from each other and respectively transmit first and second signals. The first signal forms a first electrical path along which the first signal is input to the first DUT board via the first connector. The second signal forms a second electrical path along which the second signal is output from the first DUT board and input to the second DUT board via the second connector.