Semiconductor Apparatus Dynamic Signal Path Redundancy
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Solution Overview
Problem
Conventional 3D semiconductor apparatuses with stacked chips lack redundancy in signal paths, leading to instability and failure when through vias or bumps are compromised, limiting the number of input/output lines and bandwidth.
Innovation Solution
The semiconductor apparatus includes multiple through vias and path setting units that allow for the formation of multiple signal paths between chips, enabling continued signal transmission even if one path fails, by electrically coupling chips through bumps and utilizing selection signals to manage signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple through vias are used to increase input/output lines, then the number of input/output terminals increases, but the complexity of signal path management increases
Solution Approach 1:
A path setting unit is introduced as an intermediary component between the through vias and input/output terminals. This path setting unit receives control signals and configures electrical connections between through vias and input/output terminals, thereby managing the complexity of signal path routing without increasing the physical complexity of the through via structure itself
Solution Approach 2:
The patent implements dynamically configurable signal paths through path setting units that can change electrical connections between through vias and input/output terminals based on control signals. This dynamic reconfiguration capability allows the same physical structure to support multiple input/output lines while managing signal paths flexibly without permanent complex wiring
2Reliability
If redundancy through vias are added for signal path repair, then reliability improves, but device complexity increases
Solution Approach 1:
The path setting unit provides dynamic reconfiguration capability that enables redundancy without adding permanent redundant physical structures. When a through via fails, the path setting unit dynamically reroutes signals through alternative through vias by changing electrical connections based on control signals, achieving reliability improvement without increasing structural complexity
Solution Approach 2:
The system performs self-diagnosis and self-repair through the path setting unit, which automatically detects signal path failures and reconfigures connections to maintain functionality. This self-service capability provides reliability improvement without requiring external intervention or complex manual repair mechanisms
3Ease of manufacture
If all signal lines including through vias are short-circuited, then manufacturing simplicity improves, but input/output flexibility deteriorates
Solution Approach 1:
The patent maintains simple manufacturing by keeping through vias as fixed short-circuited structures, but introduces dynamic path setting units that can configure different electrical connections between these fixed through vias and input/output terminals. This dynamic reconfiguration provides input/output flexibility without requiring complex manufacturing processes for the through vias themselves
Data Source
AI summary
A semiconductor apparatus includes first and second through vias, a first path setting unit, and a second path setting unit. The first and second through vias connect first and second chips. The first path setting unit connects a first chip circuit to a first input/output terminal, and the second through via to a second input/output terminal. The second path setting unit connects a second chip circuit to the first through via and the second through via, wherein the first through via is connected to the second input/output terminal.