Semiconductor Chip Eaves Structure for Bonding Material Containment

Solution Overview

Problem

Existing semiconductor devices face challenges in suppressing the flow of conductive bonding materials from the mounting surface to the non-mounting surface, which can lead to undesirable short circuits and hinder heat dissipation.

Innovation Solution

A semiconductor device with a laminated structure featuring a chip having a mounting surface, a non-mounting surface, and side walls with eaves portions that protrude outward, covered by a metal layer, which prevents the conductive bonding material from flowing to the non-mounting surface by forming a barrier.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the chip structure is simplified without eaves portions, then manufacturing complexity is reduced, but conductive bonding material flows to the non-mounting surface causing short circuits and heat dissipation issues

Engineering Contradiction:

Improvechip structure simplicityVSAvoidprevention of conductive bonding material flow

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The chip structure is segmented into distinct functional zones: the mounting surface area, the eaves portion (protruding edge), and the non-mounting surface area. This segmentation creates a physical boundary that confines the conductive bonding material to the mounting surface during bonding processes, preventing it from flowing onto the non-mounting surface where it could cause short circuits.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The eaves portion introduces a dimensional feature by protruding outward from the chip's main body at the side wall. This third-dimensional structure creates an overhang or barrier that physically blocks the lateral flow of conductive bonding material, effectively containing it within the mounting surface plane and preventing contamination of the non-mounting surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conductive bonding material is allowed to flow freely, then bonding process is simpler, but heat dissipation is hindered and short circuits occur

Engineering Contradiction:

Improvebonding process simplicityVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The chip structure is segmented into distinct functional zones: the mounting surface area, the eaves portion (protruding edge), and the non-mounting surface area. This segmentation creates a physical boundary that confines the conductive bonding material to the mounting surface during bonding processes, preventing it from flowing onto the non-mounting surface where it could cause short circuits.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The eaves portion introduces a dimensional feature by protruding outward from the chip's main body at the side wall. This third-dimensional structure creates an overhang or barrier that physically blocks the lateral flow of conductive bonding material, effectively containing it within the mounting surface plane and preventing contamination of the non-mounting surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11521917B2Semiconductor device

Publication Date: 2022.12.06 ROHM CO LTD

AI summary

A semiconductor device includes a chip that includes a mounting surface, a non-mounting surface, and a side wall connecting the mounting surface and the non-mounting surface and has an eaves portion protruding further outward than the mounting surface at the side wall and a metal layer that covers the mounting surface.