Semiconductor Arrangement Edge Sealing and Attachment

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Solution Overview

Problem

Conventional semiconductor arrangements face issues with humidity and substance ingress due to open interfaces between the electrically conductive plate and encapsulation material, potentially damaging the power semiconductor devices and creating weak points for attachment, which can lead to mechanical and thermomechanical stress.

Innovation Solution

The semiconductor arrangement features an electrically conductive plate with at least one edge region free from encapsulation material, allowing for secure attachment and a sealing structure to prevent external substances from reaching the power semiconductor devices, while electrically conductive blocks and a control terminal interconnection structure enhance mechanical stability and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the encapsulation material completely encloses the electrically conductive plate, then the sealing against humidity and harmful substances is improved, but the attachment strength and mechanical stability deteriorate due to creating weak spots in the encapsulation material

Engineering Contradiction:

Improveprotection against humidity and harmful substancesVSAvoidattachment strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The encapsulation is segmented into two distinct regions: a first region that completely encloses the electrically conductive plate for protection, and a second region that leaves the edge of the plate exposed for attachment. This segmentation allows the same encapsulation material to serve dual functions of protection and mechanical support.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the encapsulation are given different qualities: the first region provides complete enclosure and protection against harmful substances, while the second region provides an exposed edge for mechanical attachment. This local differentiation of encapsulation properties resolves the contradiction between sealing and attachment strength.

Inventive Principle:

Principle #3Local quality

2Reliability

If the encapsulation material completely encloses the electrically conductive plate, then the protection against harmful substances is improved, but the mechanical stress resistance deteriorates due to the weak spot created in the encapsulation

Engineering Contradiction:

Improveprotection reliabilityVSAvoidmechanical and thermomechanical stress

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The encapsulation structure is divided into protective and attachment zones, allowing the plate edge to serve as a stress distribution point rather than creating a weak spot, thereby maintaining both protection reliability and stress resistance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The exposed edge of the electrically conductive plate acts as an intermediary element between the encapsulation material and external attachment structures, distributing mechanical and thermomechanical stresses away from the encapsulation material and preventing stress concentration that would compromise protection reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the encapsulation material leaves the edge of the electrically conductive plate exposed, then the attachment strength is improved, but the protection against harmful substances deteriorates due to the open interface

Engineering Contradiction:

Improveattachment strengthVSAvoidexposure to humidity and harmful substances

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The encapsulation is segmented into a first region that provides complete enclosure for protection and a second region that exposes the plate edge for attachment, allowing both functions to coexist without compromising either protection or attachment strength.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The encapsulation provides complete enclosure locally around the plate body for protection, while deliberately leaving the edge exposed locally for attachment purposes, creating different protective qualities in different spatial locations to satisfy both protection and attachment requirements.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS10115646B2Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

Publication Date: 2018.10.30 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.