Semiconductor Edge Sensor for Crack Detection
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Solution Overview
Problem
Semiconductor devices, such as power MOSFETs, are prone to chip cracks at their outer edges, which can lead to device failure if not detected early.
Innovation Solution
A semiconductor device with an integrated sensor device that includes a sensor region in the edge region, electrically coupled to contact pads, allowing for the detection of cracks and chips around the active region, enabling early detection and prevention of device failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sensor device is integrated into the edge region of the semiconductor body, then crack detection capability is improved, but device complexity increases
Solution Approach 1:
The sensor device is merged with the semiconductor body by integrating the sensor region directly into the edge region of the semiconductor body during the same manufacturing process. This combining approach enables crack detection functionality while avoiding the need for separate external sensor components, thus improving reliability without proportionally increasing device complexity.
Solution Approach 2:
The sensor region serves multiple functions: it acts as both a structural part of the semiconductor device and a detection element for cracks. The sensor region is electrically coupled to contact pads that can be used for both normal device operation and crack detection measurements, providing multi-functionality that reduces overall system complexity.
2Ease of operation
If the sensor region is electrically coupled to contact pads on the surface, then measurement accessibility is improved, but manufacturing precision requirements increase
Solution Approach 1:
The contact pads are pre-positioned on the surface of the semiconductor body during the manufacturing process, before the device is put into service. This preliminary placement ensures that the electrical coupling between the sensor region and contact pads is established with appropriate precision during fabrication, while still allowing easy external access for measurements during operation and testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated sensor device allows for efficient and cost-effective detection of cracks and chips, preventing device failure and ensuring reliable operation by alerting the system to potential issues before they become severe.
Implementation Method 1
the sensor device includes a first sensor region of a first doping type integrated in the edge region, wherein the first sensor region is electrically coupled to a first contact pad and to a second contact pad
Data Source
AI summary
A semiconductor device includes a semiconductor body comprising a first surface, a second surface opposite to the first surface, an active region, and an edge region surrounding the active region in a horizontal plane. The semiconductor device further includes a plurality of transistor cells at least partly integrated in the active region. Each transistor cell includes a drift region separated from a source region by a body region, and a gate electrode dielectrically insulated from the body region. The semiconductor device also includes a sensor device having a first sensor region of a first doping type integrated in the edge region. The first sensor region is electrically coupled to a first contact pad and to a second contact pad. Each contact pad is arranged either on the first surface or on the second surface. The sensor device at least partially extends around the active region.