Semiconductor Package Edge Stacking for Heat Dissipation
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Solution Overview
Problem
The challenge in the semiconductor industry is to effectively arrange devices in limited package sizes while minimizing heat influence and ensuring proper filling of spaces between components, which existing technologies struggle to achieve efficiently.
Innovation Solution
The semiconductor package design includes a substrate with a semiconductor chip, spacers, and chip stacks arranged in a dolmen-like structure, where the lowermost chips of each stack are positioned on the edge areas of the chip, allowing for efficient heat dissipation and stable support, and an underfill to secure the chip and substrate connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the package size is reduced to meet miniaturization trends, then the weight and volume of the semiconductor package are reduced, but the ability to effectively arrange devices and dissipate heat becomes more difficult
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional vertical stacking architecture. Multiple semiconductor chips are stacked vertically on top of each other, utilizing the Z-dimension (height) to accommodate more devices without increasing the package's footprint area. This dimensional transition enables effective device arrangement and heat dissipation pathways in the vertical direction, resolving the contradiction between miniaturization and heat management.
2Quantity of substance
If more devices are arranged in a limited package area, then the functional capability increases, but the heat management and device arrangement efficiency deteriorate
Solution Approach 1:
By stacking chips vertically in the third dimension, the patent accommodates a greater number of devices within a confined footprint without increasing planar density to problematic levels. The vertical arrangement creates separate heat dissipation pathways for each chip layer, preventing heat accumulation and managing thermal influence effectively while housing multiple devices.
Solution Approach 2:
The patent divides the semiconductor package into multiple discrete chip layers, each capable of independent heat dissipation. The package structure is segmented into a substrate, multiple chip stacks, and interlayer structures, allowing heat to be managed at each segment level rather than as a unified thermal mass, thereby reducing overall heat influence despite containing numerous devices.
3Stability of the object's composition
If chip stacks are positioned on the center area of the semiconductor chip, then the structural support is maximized, but the heat dissipation efficiency and device arrangement flexibility are reduced
Solution Approach 1:
The patent employs asymmetric positioning of chip stacks relative to the semiconductor chip substrate. Rather than centering all stacks symmetrically, the design places stacks at optimized locations that balance structural support requirements with heat dissipation efficiency. This asymmetric arrangement allows certain stacks to be positioned for maximum thermal access to heat sinks or ventilation pathways, while maintaining overall structural integrity through strategic support element placement.
Data Source
AI summary
A semiconductor package for effectively arranging devices in a limited space is provided. The semiconductor package includes: a substrate; a semiconductor chip formed on the substrate, the semiconductor chip including a center area, a first edge area, which is disposed on a first side of the center area with respect to a first directional axis, and a second edge area, which is disposed on a second side of the center area opposite the first side with respect to the first directional axis; a first spacer formed on the substrate and spaced apart from the semiconductor chip in a direction along the first directional axis; a second spacer formed on the substrate and spaced apart from the semiconductor chip in a direction along the first directional axis; a first chip stack disposed on the semiconductor chip and the first spacer; and a second chip stack disposed on the semiconductor chip and the second spacer. A lowermost chip of the first chip stack is positioned on the first edge area of the semiconductor chip, but not on the center area of the semiconductor chip, and a lowermost chip of the second chip stack is positioned on the second edge area of the semiconductor chip, but not on the center area of the semiconductor chip.