Semiconductor Electrode Layout for Electric Field Stability

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Solution Overview

Problem

Semiconductor devices face challenges in achieving stable characteristics due to issues with electric field concentration and potential misalignment during manufacturing, leading to reliability concerns.

Innovation Solution

A semiconductor device design featuring a specific configuration of electrodes, semiconductor regions, conductive members, and insulating regions, including a third electrode between the first and second electrodes, and a conductive member connected to the second electrode, with strategically positioned insulating regions to control current and alleviate electric field concentration, along with a method for manufacturing that involves precise trench formation and insulating film deposition to ensure accurate alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional two-electrode structure is used, then the device structure is simple, but electric field concentration occurs leading to unstable characteristics

Engineering Contradiction:
Improvecharacteristic stabilityVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The second electrode is divided into two separate electrodes (second electrode and third electrode), which segment the electric field distribution and prevent concentration at a single point, thereby improving characteristic stability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A conductive member is introduced as an intermediary element between the electrodes to adjust and distribute the electric field, preventing direct concentration and improving device reliability

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If manufacturing processes are simplified, then production efficiency increases, but misalignment occurs leading to reliability issues

Engineering Contradiction:
Improvealignment accuracyVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductive member is formed in advance before subsequent electrode fabrication steps, establishing a reference structure that guides alignment and prevents misalignment in later manufacturing stages

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conductive member serves as an intermediary reference structure that facilitates precise alignment between electrodes during manufacturing, ensuring reliability without excessive process complexity

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If electric field concentration is allowed, then current flow is simple, but carrier discharge efficiency decreases

Engineering Contradiction:
Improvecarrier discharge efficiencyVSAvoidcurrent control structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The electric field is segmented into multiple regions by dividing the second electrode into separate electrodes, which distributes the carrier discharge paths and improves overall discharge efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductive member acts as an intermediary to optimize current distribution across the semiconductor region, enhancing carrier discharge efficiency without requiring complex external control circuits

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables stable characteristics and high reliability by controlling current flow and suppressing electric field concentration, reducing the risk of misalignment and improving carrier discharge efficiency.

Implementation Method 1

alleviate electric field concentration

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

The first conductive member is provided between the first partial region and the third electrode

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20240194739A1Semiconductor device and method for manufacturing the same
Publication Date: 2024.06.13 KK TOSHIBA
  • US20240194739A1 patent drawing
  • US20240194739A1 patent drawing
  • US20240194739A1 patent drawing

AI summary

According to one embodiment, a semiconductor device include first to third electrode, a semiconductor member, a first conductive member, and a first insulating member. A second insulating region of the first insulating member includes a first face facing the third partial region of the first semiconductor region. The third insulating region of the first insulating member includes a second face facing the third partial region of the first semiconductor region. The first face includes a first end on a side of the first electrode in the first direction. The second face includes a second end on a side of the second electrode in the first direction. A second position of the second end in the second direction is different from a first position of the first end in the second direction.