Semiconductor Device Electrode Positioning for Wire Bonding
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Solution Overview
Problem
The existing semiconductor device design restricts manufacturing due to the close proximity of signal electrodes from different semiconductor elements, requiring tightly packed bonding wires, which complicates the manufacturing process.
Innovation Solution
The semiconductor device design positions signal electrodes of different semiconductor elements at distinct locations perpendicular to the lamination direction, allowing for relative distance between signal terminals and electrodes, enabling easier manufacturing by using terminals that project from the sealing body and are connected via wires or directly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If signal electrodes of first and second semiconductor elements are placed at the same position in the second direction, then the device achieves compact lamination structure, but bonding wires must be placed within a relatively narrow range which restricts manufacturing
Solution Approach 1:
The patent resolves the contradiction by utilizing the first direction (perpendicular to the second direction) as an additional spatial dimension for wire placement. Specifically, bonding wires for the first semiconductor element are placed within a first range in the first direction, while bonding wires for the second semiconductor element are placed within a second range in the first direction. This dimensional separation allows both sets of wires to coexist without interference, even when signal electrodes are positioned at the same location in the second direction, thereby maintaining compact lamination while enabling straightforward manufacturing.
2Ease of manufacture
If signal electrodes are placed at different positions in the second direction, then bonding wire placement becomes easier, but the lamination structure becomes less compact
Solution Approach 1:
The patent employs dimensional separation by assigning different spatial ranges in the first direction for bonding wires connected to different semiconductor elements. This allows signal electrodes to be positioned at different locations in the second direction (improving manufacturability) while the overall device footprint remains controlled through the structured arrangement in the first direction, thus balancing compactness with ease of manufacture.
3Reliability
If multiple bonding wires are placed within a narrow range in the first direction, then signal electrode connectivity is achieved, but manufacturing complexity increases due to tight spacing requirements
Solution Approach 1:
The patent segments the bonding wire placement space by defining distinct first and second ranges in the first direction. Bonding wires for the first semiconductor element are confined to the first range, while bonding wires for the second semiconductor element are confined to the second range. This segmentation prevents wire interference and simplifies the manufacturing process by providing clear spatial guidelines for wire placement, thereby maintaining reliable signal electrode connectivity while reducing manufacturing complexity.
Data Source
AI summary
A semiconductor device includes: a first semiconductor element including a first signal electrode; a second semiconductor element, laminated on the first semiconductor element, including a second signal electrode; a sealing body; a first signal terminal connected to the first signal electrode; and a second signal terminal connected to the second signal electrode, wherein: the first signal terminal and the second signal terminal project from the sealing body and extend in a first direction; the first signal terminal and the second signal terminal are distanced from each other in a second direction; the first signal electrode and the second signal electrode are placed at different positions in the second direction; the first signal electrode is provided closer to the first signal terminal than to the second signal terminal; and the second signal electrode is provided closer to the second signal terminal than to the first signal terminal.