Semiconductor Package Electrode Layout for Flexible Land Patterns
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Solution Overview
Problem
Semiconductor devices face challenges in being mounted on substrates with various land pattern sizes due to the limitations in the exposed surface areas of electrodes and die pads, which restrict their compatibility and mounting strength.
Innovation Solution
The semiconductor device design includes a die pad and electrodes with specific exposed surface areas and shapes, where the area of the second surface of the electrodes is set smaller than the fourth surface within the resin member for mounting flexibility and the first surface of the die pad is larger for increased connection strength, allowing for mounting on substrates with diverse land pattern sizes while maintaining adhesiveness and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the exposed surface area of electrodes is increased to improve mounting compatibility, then the electrodes become more prone to fracture or detachment during cutting
Solution Approach 1:
The patent applies local quality by creating different exposed surface areas for different electrodes. Specifically, the first electrode has a larger exposed surface area than the second electrode, allowing each electrode to be optimized for its specific function - the larger electrode provides better mounting compatibility while the smaller electrode maintains sufficient strength and reduces fracture risk during cutting
2Strength
If the exposed surface area of die pad is increased to improve connection strength, then the overall device size increases
Solution Approach 1:
The patent applies local quality by creating an asymmetric configuration where only specific portions of the die pad and electrodes have exposed surfaces. The die pad has a first exposed surface area and a second exposed surface area, with the first electrode having a larger exposed surface area than the second electrode. This localized exposure strategy provides sufficient connection strength at critical interfaces while minimizing the overall device footprint
Data Source
AI summary
A semiconductor device includes a resin member, a die pad including a first surface on which a semiconductor chip is disposed and covered by the resin member, and a second surface opposite to the first surface and partially covered by the resin member such that a first portion of the second surface is exposed from the resin member, and a plurality of electrodes each separated from the die pad and including a first surface connected to the semiconductor chip and covered by the resin member, and a second surface partially covered by the resin member such that a second portion of the second surface is exposed from the resin member. The first portion of the die pad includes at least four sides, each of which is nonparallel to a side of the second portion of one of the electrodes that faces the side.