Semiconductor Electrode Interface Structure for Peel Resistance

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Solution Overview

Problem

Existing semiconductor devices face issues with poor adhesion between the electrode and the substrate, leading to peeling of the electrode, especially from the outer peripheral portion, and the formation of a crushed layer during grinding, which weakens the device.

Innovation Solution

A semiconductor device is designed with a mixed member containing semiconductor and metal materials, placed on the substrate surface in contact with the electrode, and a portion of the substrate surface is exposed at the end, enhancing adhesion and resisting peeling during processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electrode is directly placed on the substrate surface, then the device structure is simple, but the adhesion property between electrode and substrate is poor leading to peeling

Engineering Contradiction:

Improveadhesion propertyVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A mixed member comprising both semiconductor material and metal material is introduced as an intermediary layer between the electrode and substrate. This mixed member improves adhesion by providing a transition zone that bonds well with both the substrate and electrode, preventing peeling during plasma or blade dicing processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The mixed member is formed as a composite material containing both semiconductor and metal components. This composite structure combines the beneficial properties of both material types to achieve superior adhesion between the electrode and substrate while maintaining electrical functionality.

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the substrate is ground to improve surface quality, then surface finish is improved, but a crushed layer is formed weakening the device

Engineering Contradiction:

Improvesurface qualityVSAvoiddevice strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The invention removes the substrate surface layer in the peripheral region to expose a fresh surface, eliminating the need for grinding that would create a crushed layer. This extraction approach provides a clean bonding surface for the mixed member without compromising device strength.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If the electrode peripheral portion is covered completely, then coverage is improved, but peeling occurs during dicing due to stress concentration

Engineering Contradiction:

Improvepeel resistanceVSAvoidprocessing difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The mixed member is selectively formed in the peripheral region of the substrate where peeling is most likely to occur during dicing. This localized approach provides enhanced adhesion exactly where needed without requiring complete coverage, simplifying the manufacturing process while improving peel resistance.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12283614B2Semiconductor device

Publication Date: 2025.04.22 KK TOSHIBA

AI summary

Provided is a semiconductor device including: a substrate containing a semiconductor material; an electrode provided on a substrate surface of the substrate, the electrode containing a metal material; and a mixed member provided on the substrate surface to be in contact with the electrode, the mixed member containing the semiconductor material and the metal material, in which a portion of the substrate surface is exposed at an end of the substrate.