Semiconductor Electrode Adhesion via Platinum-Group Plating
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Solution Overview
Problem
There is a need for increased adhesiveness between semiconductor devices and their substrates to enhance the bonding strength and reliability of semiconductor units, light-emitting apparatuses, and display apparatuses.
Innovation Solution
Incorporating a platinum-group element as the main material for the electrodes and using a plating layer to bond the electrodes to the substrate, with an insulation layer and extension portions to increase the bonding area, thereby enhancing adhesiveness and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrodes without platinum-group elements are used, then manufacturing costs are reduced, but adhesiveness between the electrode and plating layer is insufficient
Solution Approach 1:
The invention changes the material parameter of the electrode by using a platinum-group element as the main material, which fundamentally improves the adhesiveness with the plating layer. This parameter change resolves the contradiction by accepting the higher material cost to achieve the required bonding reliability.
Solution Approach 2:
The invention creates a composite structure where the electrode (platinum-group element) and plating layer form a strongly bonded interface. This composite material approach ensures high adhesiveness while maintaining the functional requirements of the semiconductor device.
2Reliability
If the bonding area between electrode and plating layer is increased, then adhesiveness is improved, but device complexity increases
Solution Approach 1:
The invention applies local quality by concentrating the bonding function at the electrode-plating layer interface through the use of platinum-group elements. This localized approach to improving adhesiveness avoids the need for complex overall structural changes while achieving the desired bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of platinum-group elements in electrodes and a plating layer significantly increases adhesiveness and bonding strength between the semiconductor devices and substrates, leading to improved reliability and reduced manufacturing costs by simplifying the manufacturing process.
Implementation Method 1
The plating layer bonds the substrate and the electrode. The electrode including a platinum-group element as a main material is bonded to the plating layer on the substrate. Thus, adhesiveness between the electrode and the plating layer is increased, and bonding strength thereof can be enhanced.
Data Source
AI summary
[Solving Means] A semiconductor unit includes a substrate, a semiconductor device, and a plating layer. The semiconductor device includes a semiconductor layer and one or more electrodes, the one or more electrodes being connected to the semiconductor layer and including a platinum-group element as a main material. The plating layer bonds the substrate and the electrode.