Semiconductor Shielding via Conductive Coating for EMI Reduction
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Solution Overview
Problem
Advanced semiconductor devices face challenges in minimizing electromagnetic interference (EMI) due to increased integration density and component density, which affects the electrical performance and noise levels in compact electronic devices.
Innovation Solution
A semiconductor device design incorporating a conductive coating with multiple sublayers, including an interface layer, barrier layer, and conductive layer, is applied over the semiconductor dies and sidewalls to provide electromagnetic shielding, reducing EMI and enhancing signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integration density and component density are increased to achieve smaller device size, then device compactness is improved, but electromagnetic interference increases affecting electrical performance
Solution Approach 1:
The semiconductor device is divided into multiple functional packages (first package and second package) stacked vertically, with each package containing specific components. This segmentation allows EMI shielding structures to be strategically placed between packages and within individual packages, effectively isolating electromagnetic interference while maintaining compact overall device size.
Solution Approach 2:
Multiple functional layers are nested within each other, including conductive shielding layers embedded within dielectric materials, and multiple packages stacked within a compact footprint. The EMI shielding structure is nested between the first and second packages, providing protection without significantly increasing the device's external dimensions.
2Reliability
If EMI shielding structures are added to reduce electromagnetic interference, then electrical performance is improved, but package size increases
Solution Approach 1:
EMI shielding structures are applied locally at critical interfaces between packages and around sensitive conductive paths, rather than uniformly throughout the entire device. Conductive layers are strategically positioned at sidewalls of packages and within dielectric regions where EMI protection is most needed, maintaining compact overall dimensions while providing effective shielding.
Solution Approach 2:
Thin conductive shielding layers are used instead of bulky shielding materials. These thin film conductive layers are embedded within dielectric materials and positioned at package sidewalls, providing effective EMI protection with minimal increase in package volume.
3Reliability
If multiple conductive paths are shortened to improve signal propagation, then electrical performance is improved, but device complexity increases
Solution Approach 1:
Conductive paths are routed through the vertical dimension by utilizing vias that penetrate dielectric layers between packages and within packages. This three-dimensional routing approach shortens signal paths compared to traditional planar routing, improving signal propagation while the modular package structure helps manage the increased routing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, improves signal integrity, and maintains the compact form factor of semiconductor devices by integrating EMI shielding without significant increases in package size or manufacturing complexity.
Implementation Method 1
a conductive coating with multiple sublayers, including an interface layer, barrier layer, and conductive layer, is applied over the semiconductor dies and sidewalls to provide electromagnetic shielding, reducing EMI and enhancing signal propagation
Data Source
AI summary
A semiconductor device includes a first die embedded in a molding material, where contact pads of the first die are proximate a first side of the molding material. The semiconductor device further includes a redistribution structure over the first side of the molding material, a first metal coating along sidewalls of the first die and between the first die and the molding material, and a second metal coating along sidewalls of the molding material and on a second side of the molding material opposing the first side.