Semiconductor EMI Shielding Structure Using Conductive Pillars
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Solution Overview
Problem
Existing methods for RF shielding in semiconductor devices face issues such as high cost, space requirements, flux creep, delamination, and difficulty in encapsulation, particularly with embedded and externally attached metal shields, and conformal shields do not address added substrate size.
Innovation Solution
A semiconductor device structure featuring conductive spaced-apart pillar structures, such as conductive wires, attached to a substrate with distal ends extending away and a conductive shielding layer, which can be connected to the pillar structures or grounded through an external interconnect, providing efficient EMI shielding without significant substrate size increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an externally attached metal shield is used, then EMI shielding is provided, but additional board space is required and manufacturing cost increases
Solution Approach 1:
The patent transitions from planar EMI shielding (2D) to three-dimensional EMI shielding (3D) by forming conductive pillars that extend vertically from the substrate surface. This vertical dimension allows the shield to block EMI without requiring additional horizontal board space, as the shielding function is achieved through the height and spatial arrangement of the pillars rather than through lateral expansion.
Solution Approach 2:
The patent changes the physical state and configuration of the shielding structure by forming three-dimensional conductive pillars with varying heights and densities. By adjusting parameters such as pillar height, diameter, spacing, and distribution patterns, the shielding effectiveness is optimized while minimizing the footprint on the substrate, thereby resolving the contradiction between shielding performance and board space utilization.
2Object-affected harmful factors
If an externally attached metal shield is used, then EMI shielding is provided, but manufacturing cost and complexity increase
Solution Approach 1:
The patent merges the EMI shielding function with the existing wire bonding process by forming conductive pillars using the same wire bonding equipment and materials already present in the manufacturing line. This integration eliminates the need for separate shield attachment steps, reducing manufacturing complexity and cost while maintaining effective EMI shielding.
Solution Approach 2:
The conductive pillars serve multiple functions: they provide EMI shielding, act as electrical interconnects for signal or power transmission, and can function as mechanical support structures. This multi-functionality reduces the overall device complexity by consolidating multiple components into a single integrated structure, eliminating the need for separate shielding components and their associated assembly processes.
3Object-affected harmful factors
If an embedded metal shield is used, then EMI shielding is provided, but encapsulation difficulty and cost increase
Solution Approach 1:
The patent uses partial embedding where the conductive pillars extend partially through or beyond the encapsulant material rather than being fully embedded within it. This approach maintains EMI shielding effectiveness while simplifying encapsulation, as the pillars do not create complex cavities or interference patterns that would hinder complete encapsulation of the semiconductor device.
Solution Approach 2:
The patent applies localized EMI shielding by positioning conductive pillars specifically in regions where EMI protection is most critical, such as near sensitive circuitry or high-frequency signal paths. This selective placement provides effective shielding while minimizing interference with the encapsulation process, as pillars are concentrated in specific zones rather than uniformly distributed throughout the entire device structure.
Data Source
AI summary
An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillars that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillars are conductive wires. A package body encapsulates the electronic component and the conductive pillars. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive pillars. In one embodiment, the electrical connection is made through the package body. In another embodiment, the electrical connection is made through the substrate.