Semiconductor EMI Shielding Structure Using Vertical Conductive Pillars
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Solution Overview
Problem
Existing methods for RF shielding in semiconductor devices face issues such as high cost, flux creep, delamination, extrusion, and increased substrate size, while embedded and conformal shields complicate manufacturing and increase costs.
Innovation Solution
A semiconductor device structure with conductive spaced-apart pillar structures, such as conductive wires, attached to a substrate and a conductive shielding layer, providing EMI shielding efficiency with reduced size and cost, using wire-bonding processes and conformal layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an attached metal shield is used for RF shielding, then EMI shielding is provided, but cost increases and manufacturing yield decreases
Solution Approach 1:
The patent combines the RF shielding function with the existing substrate structure by forming conductive pillars directly on the substrate and integrating them with the encapsulant, eliminating the need for separate attached metal shields. This integration reduces manufacturing steps, lowers cost, and improves yield while maintaining EMI shielding effectiveness.
Solution Approach 2:
The conductive pillars serve multiple functions: they provide EMI shielding, act as structural support elements, and facilitate electrical grounding. By making the shielding structure multi-functional, the patent reduces the need for additional components and simplifies the overall manufacturing process.
2Object-affected harmful factors
If a metal shield is attached to the substrate, then EMI shielding is achieved, but substrate space increases
Solution Approach 1:
The patent transitions from planar EMI shielding (metal sheets on substrate surface) to vertical EMI shielding (conductive pillars extending upward). This dimensional change allows the shielding function to be achieved within the vertical profile rather than requiring additional horizontal substrate area, thus maintaining compact device footprint.
3Stability of the object's composition
If mold compound is transferred around an embedded metal shield, then complete encapsulation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the metal shield from the encapsulation process entirely, replacing it with conductive pillars that are formed directly on the substrate before encapsulation. This eliminates the need for complex mold transfer operations around embedded shields, as the pillars are already in their final positions and do not interfere with the molding process.
4Stability of the object's composition
If liquid dispense encapsulation is used for external shields, then complete encapsulation is achieved, but cost dramatically increases
Solution Approach 1:
The patent merges the shielding structure formation with the standard encapsulation process by forming conductive pillars using conventional wire bonding or deposition techniques that are already part of the manufacturing flow. This integration eliminates the need for expensive liquid dispense encapsulation, as the pillars are created using cost-effective, established processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces EMI radiation effects, minimizes substrate size, and simplifies manufacturing by using a cost-effective wire-bonding process, enhancing productivity and shielding efficiency.
Implementation Method 1
The conductive spaced-apart pillar structures, such as conductive wires, are attached at one end to a substrate and placed proximate to an electronic die
Implementation Method 2
the conductive wires are attached at a proximate end to the substrate with a distal end extending away from the substrate
Data Source
AI summary
An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.