Semiconductor EMI Shielding Through Encapsulant Ground Connectors

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The semiconductor industry faces challenges in miniaturizing semiconductor devices while maintaining effective EMI shielding and efficient manufacturing processes, particularly in bonding semiconductor devices with advanced packaging techniques that require sophisticated connection methods and materials.

Innovation Solution

The implementation of a semiconductor device with a redistribution substrate, interconnected modules, a conductive connector, encapsulant, and a shield that extends through the encapsulant to provide EMI shielding, utilizing techniques such as laser drilling and deposition processes to form the shield and connector, allowing for reduced device size and cost-effective manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional EMI shielding methods with backside or lateral side grounding are used, then EMI shielding effectiveness is improved, but device size increases and manufacturing complexity increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoiddevice size

Core Design Contradiction:

Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The patent transitions from traditional backside or lateral side grounding methods to a top-side grounding approach. The shield extends through the encapsulant from the top surface to make contact with the conductive connector, utilizing the vertical dimension within the existing device footprint rather than requiring additional lateral or backside space.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The shield is nested within the encapsulant structure, extending through it to reach the conductive connector. This nested configuration allows the EMI shielding function to be integrated within the existing device volume without requiring additional external space for grounding structures.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Object-affected harmful factors

If traditional EMI shielding methods with backside or lateral side grounding are used, then EMI shielding effectiveness is improved, but device complexity increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidgrounding method complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Instead of extending the shield from the backside or lateral sides of the device to ground, the patent inverts the approach by extending the shield from the top surface through the encapsulant to ground. This inversion simplifies the grounding method by eliminating the need for complex backside or lateral routing.

Inventive Principle:

Principle #13The other way round (Inversion)

3Area of moving object

If advanced packaging techniques with sophisticated connection methods are used, then integration density is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveintegration densityVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of moving objectVSEase of manufacture

Solution Approach 1:

The conductive connector serves a dual function: it provides electrical connection between modules and simultaneously serves as the grounding point for the EMI shield. This self-service approach eliminates the need for separate grounding structures, simplifying manufacturing while maintaining high integration density.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The conductive connector is designed to perform multiple functions: electrical interconnection between semiconductor modules and EMI shielding grounding. This multi-functionality reduces the number of components and manufacturing steps required, easing production complexity while achieving advanced packaging goals.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of smaller, cost-effective semiconductor devices with enhanced EMI shielding and simplified manufacturing by eliminating the need for backside or lateral side grounding methods, reducing keep-out zones, and using low-cost conductive cubes or pillars for grounding, thereby improving yield and surface area utilization.

Implementation Method 1

a shield extending through the encapsulant to make physical contact with the conductive connector

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

allowing for reduced device size and cost-effective manufacturing... utilizing techniques such as laser drilling

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS12191261B2Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture

Publication Date: 2025.01.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Semiconductor devices and method of manufacture are provided. In embodiments a conductive connector is utilized to provide an electrical connection between a substrate and an overlying shield. The conductive connector is placed on the substrate and encapsulated with an encapsulant. Once encapsulated, an opening is formed through the encapsulant to expose a portion of the conductive connector. The shield is deposited through the encapsulant to make an electrical connection to the conductive connector.