Semiconductor EMI Shielding Structure for Reliable Interconnections
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Solution Overview
Problem
Existing semiconductor devices and manufacturing methods are inefficient, leading to time-consuming and costly processes, resulting in unreliable connections and suboptimal interconnection structures.
Innovation Solution
The implementation of a semiconductor device manufacturing method that includes forming conductive shielding members and an electromagnetic interference (EMI) shielding layer, with the conductive shielding members positioned between electronic components to enhance lateral EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing methods are used, then the manufacturing process is simpler, but the connections are unreliable and the interconnection structures are suboptimal
Solution Approach 1:
The patent applies preliminary action by forming conductive shielding members and EMI shielding layers during the manufacturing process before final assembly. This prevents electromagnetic interference issues from developing later, ensuring reliable connections while managing manufacturing complexity through proactive rather than reactive measures.
Solution Approach 2:
The patent introduces conductive shielding members and EMI shielding layers as intermediary elements between electronic components. These intermediaries actively manage electromagnetic interference, improving connection reliability without requiring fundamental changes to the core manufacturing process.
2Reliability
If existing manufacturing processes are used, then the process is faster and less costly, but the connections are unreliable
Solution Approach 1:
The patent merges EMI shielding functionality with existing manufacturing processes by forming conductive shielding members and shielding layers during standard fabrication steps. This integration improves connection reliability without requiring separate, time-consuming shielding processes, thus maintaining manufacturing efficiency.
3Object-affected harmful factors
If conventional EMI shielding is used, then the structure is simpler, but the EMI shielding is insufficient
Solution Approach 1:
The patent enhances EMI shielding by introducing conductive shielding members positioned between electronic components in addition to EMI shielding layers. This multi-dimensional approach—combining lateral shielding members with planar shielding layers—provides superior EMI protection compared to conventional single-layer shielding without excessive complexity.
Data Source
AI summary
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising one or more conductive shielding members and an EMI shielding layer, and a method of manufacturing thereof.