Semiconductor Packaging With Integrated EMI Shielding Structure
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in modifying and improving manufacturing operations to effectively integrate and shield semiconductor components from external electromagnetic interference (EMI) while maintaining complex circuit designs and high integration densities.
Innovation Solution
The method involves forming a dielectric pattern with a conductive material on a temporary carrier, disposing semiconductor dies within compartments defined by the dielectric pattern, and encapsulating them with an insulating material to create an electromagnetic shielding structure, which includes a conductive layer and dielectric frame, allowing for efficient EMI shielding and protection during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding structures are added to shield semiconductor components from EMI, then electromagnetic susceptibility is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple functions into the packaging structure: the packaging substrate serves both as a mechanical support and as an EMI shielding structure by integrating conductive shielding layers within the substrate layers. This merging of structural and shielding functions reduces overall device complexity while maintaining EMI protection.
Solution Approach 2:
The packaging substrate is designed to perform multiple functions simultaneously: mechanical support, electrical interconnection through conductive traces, and electromagnetic shielding through integrated conductive layers. This multi-functionality eliminates the need for separate shielding components, reducing manufacturing difficulty.
2Quantity of substance
If multiple manufacturing operations are implemented for integration of various semiconductor packages, then integration density is improved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent performs preliminary actions during the substrate fabrication process by pre-integrating conductive shielding layers and interconnection traces into the packaging substrate before component assembly. This preliminary integration of multiple functions reduces the number of subsequent manufacturing operations required.
Solution Approach 2:
Multiple manufacturing operations are merged into fewer process steps by integrating the formation of conductive traces, shielding layers, and structural features into a single substrate fabrication process, thereby reducing overall manufacturing cycle time while maintaining high integration density.
3Quantity of substance
If feature size is reduced to increase integration density, then more components can be integrated, but manufacturing precision requirements increase
Solution Approach 1:
The patent compensates for reduced in-plane feature sizes by utilizing the vertical dimension through multi-layer substrate construction. Conductive shielding layers and interconnection traces are distributed across multiple layers, allowing integration density to increase through layer stacking rather than solely through feature size reduction, thereby easing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the integration of semiconductor dies while effectively shielding them from EMI, improving manufacturing efficiency and reducing electromagnetic susceptibility, thereby supporting the integration of complex circuit designs and high-density packaging.
Implementation Method 1
an electromagnetic shielding compartment laterally encapsulating the insulating encapsulation and the semiconductor die. The electromagnetic shielding compartment includes a conductive layer and a dielectric frame laterally covering the conductive layer
Implementation Method 2
an insulating encapsulation laterally encapsulating the semiconductor die
Data Source
AI summary
A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a first semiconductor die, an insulating encapsulation laterally encapsulating the first semiconductor die, an electromagnetic shielding structure enclosing the first semiconductor die and a first portion of the insulating encapsulation, and a redistribution structure. The electromagnetic shielding structure includes a first conductive layer and a dielectric frame laterally covering the first conductive layer. The first conductive layer surrounds the first portion of the insulating encapsulation and extends to cover a first side of the first semiconductor die. The dielectric frame includes a first surface substantially leveled with the first conductive layer. The redistribution structure is disposed on a second side of the first semiconductor die opposing to the first side, and the redistribution structure is electrically coupled to the first semiconductor die and the first conductive layer of the electromagnetic shielding structure.