Semiconductor Emitter With Deep-Level Dopants

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Solution Overview

Problem

Semiconductor devices face challenges in reducing temperature-dependent characteristics, such as emitter efficiency and threshold voltage, which affect their performance and reliability, particularly in high-temperature conditions.

Innovation Solution

The semiconductor device incorporates a first semiconductor region with a second semiconductor region of different material, featuring deep-level dopants with higher solubility in the second region, which helps in reducing temperature-dependent characteristics by increasing emitter efficiency and surge current ruggedness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor devices are used, then they can operate at various temperatures, but their characteristics (emitter efficiency, threshold voltage) are highly temperature-dependent, leading to performance degradation at high temperatures

Engineering Contradiction:
Improvetemperature independence of characteristicsVSAvoidon-state power losses
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent introduces a second semiconductor region with different material composition (higher Ge content) specifically in the emitter region, while maintaining the first semiconductor region (Si-based) in the drift zone. This local differentiation allows the emitter to have enhanced properties (higher deep-level dopant solubility) without compromising the overall device structure, thereby reducing temperature-dependent power losses while maintaining reliability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the material composition parameter by introducing a second semiconductor region with different Ge content (x2 > x1), which fundamentally alters the solubility characteristics for deep-level dopants. This parameter change enables the emitter efficiency to be improved and temperature dependence to be reduced, directly addressing the contradiction between reliability and energy loss

Inventive Principle:
Principle #35Parameter changes

2Reliability

If deep-level dopants are used in the emitter region, then emitter efficiency and surge current ruggedness are improved, but the dopant solubility is limited in traditional Si-based materials

Engineering Contradiction:
Improveemitter efficiency and surge current ruggednessVSAvoiddeep-level dopant concentration
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent creates a local quality difference by introducing a second semiconductor region (SiGe or SiC) specifically in the emitter region where deep-level dopants are needed. This region has higher solubility for deep-level dopants compared to conventional Si, allowing increased dopant concentration (quantity) to achieve the desired emitter efficiency and surge current ruggedness without compromising device reliability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite semiconductor materials consisting of two different semiconductor regions with different Ge contents. The second region (Si1-x2Gex2) acts as a composite material that combines the benefits of Si with enhanced Ge content, providing both the structural integrity needed for device operation and the increased dopant solubility required for high emitter efficiency and surge current ruggedness

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS10177230B2Semiconductor device including at least one type of deep-level dopant
Publication Date: 2019.01.08 INFINEON TECHNOLOGIES AG
  • US10177230B2 patent drawing
  • US10177230B2 patent drawing
  • US10177230B2 patent drawing

AI summary

A semiconductor device includes a first semiconductor region including a first semiconductor material and a second semiconductor region adjoining the first semiconductor region, the second semiconductor region including a second semiconductor material different from the first semiconductor material. The semiconductor device further includes at least one of a drift zone and a base zone in the first semiconductor region, and at least one type of deep-level dopant in an emitter region of the second semiconductor region. The at least one type of deep-level dopant has a distance to the valence or conduction band of at least 100 meV.