Semiconductor Emitter Pad Segmentation for Zinc Deposition Control

Solution Overview

Problem

The existing semiconductor devices with small area Kelvin emitter electrode pads face issues with the peeling off of bonding wires or clip conductors due to excessive zinc deposition during the zincate treatment, leading to unreliable connections.

Innovation Solution

The semiconductor device design includes a first conductive layer connected to the emitter region with a larger emitter pad and a second conductive layer having a smaller Kelvin emitter pad and a relay pad, where the Kelvin emitter pad and relay pad are electrically connected, and a clip conductor is used to connect the emitter and relay pads, preventing excessive zinc deposition and enhancing connection stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a small area electrode pad is used for Kelvin emitter, then the device can detect emitter potential, but the connection portion of bonding wire or clip conductor may be peeled off due to excessive zinc deposition

Engineering Contradiction:

Improveemitter potential detection capabilityVSAvoidconnection stability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The electrode pad structure is segmented into two distinct conductive layers: a first conductive layer with a first electrode pad having a larger area, and a second conductive layer with a second electrode pad (Kelvin emitter pad) having a smaller area. This segmentation allows the smaller Kelvin emitter pad to perform potential detection while the larger first electrode pad provides a robust connection area that prevents peeling during zincate treatment.

Inventive Principle:

Principle #1Segmentation

2Measurement precision

If a small area electrode pad is used for Kelvin emitter, then the device can detect emitter potential, but the bonding wire or clip conductor connection becomes unreliable

Engineering Contradiction:

Improveemitter potential detection capabilityVSAvoidbonding wire connection strength

Core Design Contradiction:

Measurement precisionVSStrength

Solution Approach 1:

The electrode pad structure is segmented into two distinct conductive layers: a first conductive layer with a first electrode pad having a larger area, and a second conductive layer with a second electrode pad (Kelvin emitter pad) having a smaller area. This segmentation allows the smaller Kelvin emitter pad to perform potential detection while the larger first electrode pad provides a robust connection area that prevents peeling during zincate treatment.

Inventive Principle:

Principle #1Segmentation

3Strength

If a large area electrode pad is used for emitter, then the connection strength is improved, but the device cannot effectively detect emitter potential

Engineering Contradiction:

Improveconnection strengthVSAvoidemitter potential detection capability

Core Design Contradiction:

StrengthVSMeasurement precision

Solution Approach 1:

The electrode pad structure is segmented into two distinct conductive layers: a first conductive layer with a first electrode pad having a larger area, and a second conductive layer with a second electrode pad (Kelvin emitter pad) having a smaller area. This segmentation allows the smaller Kelvin emitter pad to perform potential detection while the larger first electrode pad provides a robust connection area that prevents peeling during zincate treatment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first conductive layer acts as an intermediary between the emitter region and the external connection. It provides a large area for robust mechanical and electrical connection while the second conductive layer with the smaller Kelvin emitter pad enables precise potential detection, thus mediating between the conflicting requirements of connection strength and measurement precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents peeling of the bonding wire connection portion by controlling zinc deposition and allows for increased current flow, ensuring reliable electrical connections and improved device performance.

Implementation Method 1

excessive zinc deposition during the zincate treatment

Methodology Applied

Scientific EffectZincate treatment: Electrodeposition

Data Source

PatentUS20230111921A1Semiconductor device and method of manufacturing the same

Publication Date: 2023.04.13 RENESAS ELECTRONICS CORP

AI summary

First conductive layer is connected to an impurity region which is a source region or an emitter region. A first conductive layer having an emitter pad and a second conductive layer having a Kelvin emitter pad and a relay pad are separated. A plane occupied area of the Kelvin emitter pad is smaller than a plane occupied area of the emitter pad.