Semiconductor Encapsulation Shield Layout for EMI Without Bulk

Solution Overview

Problem

The existing semiconductor encapsulation structures with metal covers are too large, contradicting the trend towards miniaturization and high integration due to signal crosstalk issues from electromagnetic interference, which requires an effective electromagnetic shield without increasing the size.

Innovation Solution

A semiconductor encapsulation structure incorporating a circuit board with electromagnetic and non-electromagnetic shield areas, a thin film encapsulation layer, and an electromagnetic shield structure that uses a conductive filling shield wall and electromagnetic shield sputtered coating to form a closed space, reducing the overall size while effectively shielding electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal cover is used for electromagnetic shielding, then electromagnetic interference is effectively blocked, but the overall size of the semiconductor encapsulation structure increases

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidencapsulation structure size

Core Design Contradiction:

Object-affected harmful factorsVSVolume of stationary object

Solution Approach 1:

The circuit board is divided into electromagnetic shield areas and non-electromagnetic shield areas, with shielding structures only in regions where electronic devices are located. This segmented approach provides targeted electromagnetic protection while avoiding unnecessary shielding in other areas, thus reducing overall structure size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board are assigned different shielding properties based on their functional requirements. Electronic device areas receive electromagnetic shielding through conductive filling shield walls and sputtered coatings, while other areas remain without shielding structures, optimizing both protection and size.

Inventive Principle:

Principle #3Local quality

2Volume of stationary object

If electronic devices are placed close together for miniaturization, then integration level increases, but signal crosstalk and electromagnetic interference worsen

Engineering Contradiction:

Improveencapsulation structure sizeVSAvoidsignal crosstalk

Core Design Contradiction:

Volume of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The circuit board is divided into electromagnetic shield areas and non-electromagnetic shield areas, with shielding structures only in regions where electronic devices are located. This segmented approach provides targeted electromagnetic protection while avoiding unnecessary shielding in other areas, thus reducing overall structure size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the circuit board are assigned different shielding properties based on their functional requirements. Electronic device areas receive electromagnetic shielding through conductive filling shield walls and sputtered coatings, while other areas remain without shielding structures, optimizing both protection and size.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If a metal cover is used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidshielding structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Traditional mechanical metal cover shielding structures are replaced with conductive filling shield walls and electromagnetic shield sputtered coatings that are integrated into the circuit board during manufacturing. This substitution eliminates separate assembly steps and reduces structural complexity while maintaining shielding effectiveness.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The electromagnetic shielding function is merged with the circuit board structure itself through conductive filling and sputtered coating processes. Instead of adding a separate metal cover, the shielding becomes an integrated part of the board, simplifying both structure and manufacturing.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the size of the semiconductor encapsulation structure and enhances integration by providing effective electromagnetic shielding without increasing the height of the non-electromagnetic shield area, thus addressing the contradiction between miniaturization and shielding needs.

Implementation Method 1

an electromagnetic shield sputtered coating 108 is located on a surface of the thin film encapsulation layer 104 facing away from the circuit board 101

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS11764163B2Semiconductor encapsulation structure and encapsulation method

Publication Date: 2023.09.19 LUXSHARE ELECTRONICS TECH (KUNSHAN) LTD

AI summary

Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.