Heat-Curable Resin Composition for Semiconductor Encapsulation
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Solution Overview
Problem
Semiconductor packages face challenges with high temperature reflow resistance, insulation properties, and moldability due to the limitations of existing epoxy resin compositions, which often result in peeling, cracking, and poor electrical performance.
Innovation Solution
A heat-curable resin composition combining a solid epoxy resin, silicone-modified epoxy resin, cyclic imide compound, organic filler, and anionic curing accelerator, optimized to provide high tracking resistance, low permittivity, and low dielectric tangent, with improved moldability and reflow resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the crosslinking density of epoxy resin composition is increased to achieve high Tg, then the glass-transition temperature is improved, but the elastic modulus increases and water absorption rate increases
Solution Approach 1:
The patent uses a composite curing system combining phenolic resin and maleimide compound with epoxy resin. This composite approach creates a balanced crosslinking structure that achieves high Tg while controlling elastic modulus and water absorption through the synergistic effects of different curing agents with distinct chemical structures and reaction characteristics.
Solution Approach 2:
The patent optimizes the ratio of phenolic resin to maleimide compound curing agents, along with controlling epoxy resin molecular weight and structure parameters. By adjusting these chemical parameters, the composition achieves the desired balance between Tg, elastic modulus, and water absorption rate.
2Strength
If phenyl groups are present in epoxy resin to improve structural stability, then the resin strength is improved, but the insulation property deteriorates
Solution Approach 1:
The patent introduces hydrophobic groups at specific locations within the resin system to locally counteract the polar effects of phenyl groups. This localized modification approach maintains the structural stability provided by phenyl groups while improving insulation properties through strategic placement of non-polar hydrophobic segments.
Solution Approach 2:
The combination of phenolic resin, maleimide compound, and epoxy resin creates a composite system where the different molecular structures complement each other. The maleimide and phenolic components provide structural stability while the overall composition achieves improved insulation through the balanced interaction of different chemical groups.
3Reliability
If dicyclopentadiene-type epoxy resin is used to improve tracking resistance, then the CTI value is improved, but the compatibility with other components deteriorates
Solution Approach 1:
The patent controls the molecular weight and structural parameters of the dicyclopentadiene-type epoxy resin within specific ranges. By optimizing these physical parameters, the resin achieves high tracking resistance while maintaining adequate compatibility with phenolic resin and maleimide compound curing agents through controlled reactivity and viscosity.
4Reliability
If the encapsulation resin elasticity is lowered to reduce stress in reflow, then the peeling resistance is improved, but the crack resistance deteriorates
Solution Approach 1:
The patent creates a composite crosslinked network using phenolic resin and maleimide compound that provides both flexibility and strength. The dual-curing system generates a balanced matrix structure that simultaneously improves peeling resistance through controlled elasticity and crack resistance through enhanced toughness and energy absorption capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior tracking resistance, dielectric properties, and continuous moldability, enhancing the reliability and performance of semiconductor devices by reducing stress and improving insulation and reflow resistance.
Implementation Method 1
containing: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (E) an anionic curing accelerator
Data Source
AI summary
Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains:(A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.;(B) a silicone-modified epoxy resin;(C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups;(D) an organic filler; and(E) an anionic curing accelerator.