Semiconductor Module Encapsulation With Sacrificial Anti-Corrosion Particles
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Solution Overview
Problem
Power semiconductor devices are susceptible to corrosion from sulfur-containing gases, and current protection methods are either expensive or ineffective in all conditions.
Innovation Solution
A semiconductor module and device design that incorporates a concentration of sacrificial particles, such as metal salts, semi-metal salts, or metal oxides with a cation, dispersed within an electrically insulating polymer to react with corrosive gases and prevent corrosion on metal surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current protection methods are used to protect semiconductor devices from sulfur-containing gas corrosion, then corrosion protection is achieved, but the implementation cost increases and effectiveness is limited in certain conditions
Solution Approach 1:
The patent employs sacrificial particles made from inexpensive metals (zinc, aluminum, magnesium, or their alloys) that are deliberately designed to corrode preferentially and sacrificially. These particles are consumed over time to protect the valuable semiconductor components, providing an cost-effective corrosion protection solution that does not require expensive protective coatings or complex protection systems.
Solution Approach 2:
The sacrificial particles act as an intermediary between the corrosive sulfur-containing environment and the semiconductor device components. These particles intercept the corrosive gases (H2S, SO2, COS, CS2) and convert them into stable sulfides, thereby mediating the interaction and preventing direct contact between the corrosive gases and the metal surfaces of the semiconductor device.
2Reliability
If traditional encapsulation materials are used, then semiconductor devices are protected from environmental factors, but the materials have high viscosity that complicates the encapsulation process
Solution Approach 1:
The patent creates a composite encapsulation material by dispersing sacrificial particles throughout the polymer matrix. This composite structure combines the protective properties of the polymer encapsulant with the active corrosion protection of the sacrificial particles, providing both environmental protection and corrosion resistance in a single integrated material system.
Solution Approach 2:
The sacrificial particles are strategically distributed within the encapsulation material to provide localized corrosion protection at critical interfaces and surfaces. The particles concentrate at metal-polymer interfaces and in regions most susceptible to corrosion, providing targeted protection where it is most needed while maintaining the overall structural integrity of the encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sacrificial particles effectively form stable sulfides with sulfur-containing gases, maintaining dielectric strength and preventing corrosion, while allowing for lower viscosity polymer matrices and reduced costs in encapsulation processes.
Implementation Method 1
The sacrificial particles are configured react with corrosive gases that may diffuse into the volume of electrically insulating polymer and thereby deprive the protected metal surface of a corresponding corrosive reaction
Implementation Method 2
The sacrificial particles are configured react with corrosive gases that may diffuse into the volume of electrically insulating polymer
Data Source
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AI summary
A semiconductor module includes a power electronics carrier including a structured metallization layer (104) disposed on an electrically insulating substrate (106), a power semiconductor die (108) mounted on the power electronics carrier, a housing (118) that surrounds an interior volume over the power electronics carrier, a volume of electrically insulating polymer material (126) disposed within the interior volume, and a concentration of sacrificial particles (128) dispersed within the volume of electrically insulating polymer, wherein the sacrificial particles are a metal salt, semi-metal salt, metal oxide, or semi-metal oxide with a cation.