Semiconductor Encapsulating Epoxy Resin Composition
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Solution Overview
Problem
Conventional epoxy resin compositions for semiconductor encapsulation face challenges in achieving heat resistance and moisture-proof reliability, particularly when exposed to elevated temperatures, due to the decomposition of phosphorus-based flame retardants which generate phosphoric acid, leading to corrosion of aluminum conductors and degradation of mechanical and electrical properties.
Innovation Solution
A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, and a rare earth oxide, along with a phosphazene compound, which effectively traps impurity ions and maintains ion trapping ability even under hot humid conditions, providing improved heat resistance and moisture-proof reliability without the need for bromides or antimony compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If phosphorus-based flame retardants are added to epoxy resin compositions, then flame retardance is improved, but phosphoric acid is generated when exposed to high temperatures, causing corrosion of aluminum conductors and deteriorating reliability
Solution Approach 1:
The patent changes the chemical composition parameters by replacing phosphorus-based flame retardants with nitrogen-based flame retardants (melamine, cyanuramide, or isocyanurate compounds). This parameter change eliminates the generation of phosphoric acid at high temperatures while maintaining flame retardance, thus resolving the contradiction between flame safety and heat-resistant reliability
Solution Approach 2:
The patent uses readily available nitrogen-based flame retardant compounds that decompose safely without generating harmful byproducts. These substitutes provide the necessary flame retardance function without the long-term reliability issues caused by phosphoric acid corrosion, effectively replacing the problematic phosphorus-based additives
2Object-affected harmful factors
If halogenated epoxy resins combined with antimony trioxide are used, then flame retardance is enhanced through radical-trapping and air-shielding effects, but halide ions promote formation of metal compounds in joint areas, deteriorating mechanical strength and electrical properties
Solution Approach 1:
The patent extracts and removes halogenated epoxy resins and antimony trioxide from the composition. By eliminating these components, the source of halide ions that cause metal compound formation and strength degradation is removed, while flame retardance is maintained through alternative nitrogen-based additives
Solution Approach 2:
The patent creates a composite material system combining epoxy resin with nitrogen-based flame retardants (melamine, cyanuramide, or isocyanurate) and appropriate curing agents. This composite approach achieves flame retardance without the harmful effects of halogen-antimony combinations, preserving both mechanical strength and electrical properties
3Object-affected harmful factors
If hydroxides such as Al(OH)3 and Mg(OH)2 are added in larger amounts to achieve flame retardance, then flame retardant effect is improved, but viscosity increases to a deleterious level, causing molding defects such as voids and wire flow
Solution Approach 1:
The patent changes the type of flame retardant from inorganic hydroxides to organic nitrogen-based compounds. This parameter change allows achieving adequate flame retardance with lower additive amounts, thereby maintaining acceptable viscosity levels and avoiding molding defects such as voids and wire flow
Solution Approach 2:
The patent uses nitrogen-based flame retardants that can be effectively distributed at lower concentrations throughout the epoxy resin matrix. This localized effectiveness maintains flame retardance performance without the excessive viscosity increase that would compromise molding quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition cures into a product with enhanced heat resistance, flame retardance, and moisture-proof reliability, preventing the generation of phosphoric acid and maintaining the integrity of semiconductor devices at high temperatures, while being environmentally friendly and free from the negative impacts of bromides and antimony compounds.
Implementation Method 1
a rare earth oxide in an amount of 0.5 to 20 parts by weight per 100 parts by weight of the epoxy resin (A) and the phenolic resin curing agent (B) combined, wherein the rare earth oxide has an ability to trap ions
Implementation Method 2
a phosphazene compound of an average compositional formula (1)... (E) a phosphazene compound having an average compositional formula (1) in an amount of 1 to 50% by weight based on the total weight of the epoxy resin (A), the phenolic resin curing agent (B), and the phosphazene compound (E)
Data Source
AI summary
Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.