Semiconductor Device Signal Equalization via Parasitic Capacitance
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving high-density signal transmission due to the need for space to connect signal waveform correction circuits, which increases the area occupied and reduces mounting density.
Innovation Solution
The semiconductor device incorporates a chip component with an equalizer circuit composed of passive elements, strategically positioned to correct signal waveforms by utilizing parasitic capacitance and carefully controlling the path length between the semiconductor chip and the chip component, thereby amplifying signal gain without active elements and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit for correcting a signal waveform is connected to the signal transmission path, then signal waveform correction is improved, but mounting density decreases due to the space required for the correction circuit
Solution Approach 1:
The equalizer circuit is extracted from the semiconductor chip and placed on a separate chip component mounted on the wiring substrate. This separation allows the semiconductor chip to maintain high mounting density while the equalizer circuit provides necessary signal waveform correction through passive elements (inductors and capacitors) arranged on the substrate away from the chip area.
Solution Approach 2:
The wiring substrate acts as an intermediary carrier that hosts both the semiconductor chip and the equalizer circuit components. The substrate's wiring patterns and passive elements serve as mediators to connect the chip to the correction circuit, enabling signal waveform correction without requiring the correction circuit to be integrated within the chip itself.
2Reliability
If the path distance from the electrode pad to the equalizer circuit is increased, then signal waveform correction effectiveness is improved, but signal transmission loss increases
Solution Approach 1:
The path distance is optimized to specific parameter ranges (1/16 to 3.5/16 of signal wavelength) to achieve effective signal waveform correction while minimizing transmission loss. This parameter optimization allows the equalizer circuit to function effectively without requiring excessive path length that would cause significant signal attenuation.
Solution Approach 2:
The equalizer circuit uses a combination of series inductors and shunt capacitors arranged in a ladder topology, providing incremental correction along the signal path. This partial correction approach distributed along the path achieves effective waveform correction without requiring a single excessive-length connection that would increase loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved signal waveform correction and increased mounting density by simplifying the chip component layout and reducing power requirements, while maintaining effective signal transmission at high speeds.
Implementation Method 1
correcting signal waveforms by utilizing parasitic capacitance and carefully controlling the path length
Data Source
AI summary
Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.