Semiconductor Evaluation Fluid Spraying for Partial Discharge Prevention
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Solution Overview
Problem
Existing semiconductor evaluating methods face challenges in preventing partial discharge during electrical characteristic evaluation, leading to device malfunction and increased costs due to the need for expensive equipment and prolonged evaluation times, especially when dealing with semiconductor wafers and chips.
Innovation Solution
A semiconductor evaluating device and method that incorporates a chuck stage, contact probe, and fluid spraying portion to spray a fluid onto the measuring object, preventing partial discharge without the need for a sealed measurement space or additional fluid handling processes, thereby reducing costs and evaluation time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inspection is carried out in a closed space filled with inert gas, then partial discharge is prevented, but device complexity and evaluation time increase
Solution Approach 1:
The patent extracts the essential function of preventing partial discharge by applying fluid spraying only to the measuring object surface rather than filling an entire closed space with inert gas. This eliminates the need for complex sealed chambers while maintaining discharge prevention.
Solution Approach 2:
The patent introduces fluid spraying as an intermediary mechanism between the contact probe and measuring object. The fluid acts as a mediator that prevents direct electrical discharge while allowing the evaluation process to continue, replacing the need for complex inert gas filling systems.
2Reliability
If inspection is carried out in a closed space filled with inert gas, then partial discharge is prevented, but evaluation time increases due to filling requirements
Solution Approach 1:
The patent applies fluid spraying as a preliminary protective measure directly onto the measuring object before electrical evaluation begins. This eliminates the need for time-consuming inert gas filling procedures while ensuring discharge prevention is established beforehand.
Solution Approach 2:
The patent transitions from a static sealed chamber system to a dynamic fluid spraying system. The fluid can be applied continuously or as needed during the evaluation process, allowing flexible timing that eliminates fixed filling cycles and reduces overall evaluation time.
3Reliability
If insulating liquid is used for evaluation, then partial discharge is prevented, but cost increases and liquid removal processing is required
Solution Approach 1:
The patent uses a disposable or easily replaceable fluid spraying system rather than requiring expensive, complex liquid handling infrastructure. The fluid can be applied and then easily removed or replaced without requiring sophisticated recovery or disposal systems, reducing both cost and processing complexity.
Solution Approach 2:
The patent extracts the liquid handling complexity by using a spraying mechanism that deposits fluid only where needed on the measuring object surface, rather than requiring system-wide liquid filling and removal processes. This separates the protective function from the complex liquid management infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents partial discharge during semiconductor evaluations, enhancing yield and reducing operational costs by simplifying the evaluation process and eliminating the need for complex sealing or fluid handling procedures.
Implementation Method 1
a fluid spraying portion for spraying a fluid onto the measuring object
Data Source
AI summary
A semiconductor evaluating device includes a chuck stage for holding a semiconductor device serving as a measuring object, a contact probe for evaluating an electrical characteristic of the semiconductor device by getting contact with the semiconductor device held on the chuck stage, and a fluid spraying portion for spraying a fluid onto the semiconductor device.