Semiconductor Package with Exposed Lead Frame Segments
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Solution Overview
Problem
Conventional semiconductor device packaging methods limit packaging density by confining IC chips and related components within the mold material, restricting efficient utilization of lead frames and preventing high-density component assembly.
Innovation Solution
Exposing lead frame segments outside the mold material allows for the assembly of IC chips and related components, such as passive components, printed circuit boards, and ball grid arrays, in a vertical configuration over the lead frame, enhancing packaging density and enabling efficient connection to external circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If IC chips and related components are packaged within the mold material on the same side of the lead frame, then the packaging structure is simple and conventional, but the packaging density is limited and lead frame utilization is inefficient
Solution Approach 1:
The patent transitions from conventional planar packaging (all components on the same side within the mold material) to three-dimensional vertical packaging by exposing lead frame fingers outside the mold material. This allows components to be stacked vertically in multiple layers, with IC chips on the first side of the lead frame and passive components on the opposite side, thereby significantly increasing packaging density without proportionally increasing structural complexity.
2Quantity of substance
If all components are assembled inside the mold material, then the packaging is conventional and easy to manufacture, but the lead frame cannot be efficiently utilized and packaging density is restricted
Solution Approach 1:
The patent segments the packaging structure by dividing components into two groups: IC chips packaged within the mold material on one side of the lead frame, and passive components packaged outside the mold material on the opposite side. This segmentation allows each group to be assembled using conventional processes while achieving higher overall density through the exposed lead frame fingers that extend outside the mold material.
3Quantity of substance
If lead frame fingers are fully enclosed within the mold material, then the packaging is conventional and mechanically stable, but related components cannot be assembled outside the mold material to improve packaging density
Solution Approach 1:
The patent implements a nested packaging structure where IC chips are encapsulated within the mold material on one side of the lead frame, while passive components are mounted on the exposed lead frame fingers that extend outside the mold material on the opposite side. This nested arrangement maintains the mechanical stability of the enclosed IC chips while utilizing the external space for additional components, thereby increasing packaging density without compromising structural integrity.
Data Source
AI summary
Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.