Exposed Wiring Boards for Semiconductor Heat Dissipation
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Solution Overview
Problem
Semiconductor devices using ceramic substrates face inefficiencies in heat dissipation, as generated heat cannot be effectively released to the outside.
Innovation Solution
A semiconductor device design featuring multiple wiring boards with semiconductor elements mounted on their surfaces, connected to terminals, and sealed with resin to expose the second main surfaces of the boards, allowing for efficient heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate is used to mount semiconductor elements, then the device structure is stable and reliable, but heat generated in the semiconductor elements cannot be efficiently released to the outside
Solution Approach 1:
The lead frame is divided into multiple wiring boards (first wiring board, second wiring board, third wiring board) with distinct functions. The first and second wiring boards serve as heat dissipation paths with their second main surfaces exposed for thermal release, while the third wiring board provides electrical connection. This segmentation allows simultaneous achievement of structural stability and efficient heat dissipation through dedicated thermal pathways.
Solution Approach 2:
The lead frame serves multiple functions simultaneously: it provides mechanical support and structural stability, establishes electrical connections between semiconductor elements and external terminals, and acts as a heat dissipation system through the exposed second main surfaces of the wiring boards. This multi-functionality resolves the contradiction by integrating heat dissipation capability into the existing structural framework.
2Reliability
If semiconductor elements are mounted on ceramic substrates and sealed with resin, then the device is protected and sealed, but heat release efficiency deteriorates
Solution Approach 1:
The second main surfaces of the first and second wiring boards are extracted from the sealed region by the resin, allowing these surfaces to remain exposed to the external environment. This extraction creates dedicated heat dissipation pathways that bypass the thermal insulation effect of the resin sealing, enabling efficient heat release while maintaining device protection in the sealed interior regions.
3Temperature
If multiple wiring boards are used to improve heat dissipation, then heat release efficiency improves, but device complexity increases
Solution Approach 1:
Multiple wiring boards with different functions (heat dissipation and electrical connection) are merged into a single integrally formed lead frame structure. This integration eliminates the need for separate components and assembly steps, reducing overall device complexity while maintaining the heat dissipation benefits of multiple wiring boards. The functional differentiation is achieved through the integral structure's geometry and material properties rather than separate parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat transfer from the semiconductor elements to the wiring boards with high thermal conductivity, effectively releasing heat to the outside, thereby improving heat dissipation and reducing electrical loss.
Implementation Method 1
heat generated in the semiconductor elements can be efficiently transferred from the first main surfaces to the second main surfaces through the wiring boards with high thermal conductivity
Data Source
AI summary
A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor elements disposed on first main surfaces of the wiring boards and electrically connected to the wiring boards; a plurality of terminals electrically connected to the wiring boards; a sealing resin sealing the wiring boards and the semiconductor elements so that second main surfaces of the wiring boards are exposed.