Semiconductor Package Extension Frames for Flexible Mounting
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Solution Overview
Problem
Semiconductor packages with metal wings face increased manufacturing complexity, cost, and reduced flexibility due to additional process steps, specialized assembly requirements, and fixed mounting locations, which complicates mounting on circuit boards and heat sinks.
Innovation Solution
The use of package extension frames that attach to the semiconductor module's side surfaces, allowing for easy handling, alignment, and mechanical coupling to circuit boards and heat sinks without pre-defined mounting holes, reducing the number of fasteners and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal wings are used for mounting semiconductor modules, then mechanical coupling strength is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the mounting function from integrated metal wings and separates it into independent package extension frames. These frames are attached to the package body's side surfaces, allowing the mounting function to be fulfilled without requiring complex metal wing structures integrated into the package body, thus reducing overall device complexity while maintaining mechanical coupling strength.
Solution Approach 2:
The mounting structure is segmented into separate components: the package body, the package extension frames attached to its side surfaces, and the mounting holes. This segmentation allows each component to be optimized independently and simplifies manufacturing compared to monolithic metal wing structures.
2Manufacturing precision
If metal wings with pre-defined mounting holes are used, then mounting position is fixed, but adaptability to different mounting configurations is reduced
Solution Approach 1:
The package extension frames provide dynamic adaptability by allowing mounting holes to be positioned at different locations along the side surfaces. Unlike fixed metal wings, the frames can accommodate varying mounting configurations while maintaining proper alignment, enabling the same package design to adapt to different circuit board layouts and mounting requirements.
3Reliability
If specialized assembly processes for metal wings are used, then mechanical coupling reliability is improved, but ease of manufacture is reduced
Solution Approach 1:
The package extension frames are pre-attached to the package body's side surfaces before final assembly. This preliminary action ensures proper positioning and alignment are established early in the manufacturing process, eliminating the need for complex specialized assembly procedures required for metal wings while maintaining mechanical coupling reliability.
4Ease of manufacture
If package extension frames are used instead of metal wings, then manufacturing cost is reduced, but mechanical coupling strength may be compromised
Solution Approach 1:
The package extension frames concentrate mechanical coupling strength at specific local points where they attach to the package body side surfaces and where mounting holes are positioned. Rather than distributing material throughout complex metal wing structures, the frames provide localized reinforcement exactly where mechanical coupling is needed, maintaining strength while reducing overall material usage and manufacturing cost.
Data Source
AI summary
A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.