Semiconductor Device Exterior Member Bonding
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Solution Overview
Problem
The existing semiconductor device manufacturing method requires a mold-releasing sheet and vacuum processes, increasing costs due to the need for forming through holes and using a vacuum device.
Innovation Solution
A semiconductor device design where an exterior member with a loop-shaped bank portion is directly bonded to the base substrate, eliminating the need for a mold-releasing sheet and vacuum processes by forming a housing space that is sealed with a sealing material, thus reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mold-releasing sheet is used in the cavity to facilitate removal of the sealed substrate, then the ease of manufacture is improved, but the cost increases due to the need for additional materials and vacuum processing equipment
Solution Approach 1:
The invention extracts and eliminates the mold-releasing sheet from the manufacturing process. Instead of using a separate releasing sheet, the cavity itself is designed with a releasing structure that allows the sealed substrate to be easily removed without additional materials or vacuum processing equipment.
Solution Approach 2:
The cavity structure provides its own releasing function through the designed releasing structure, eliminating the need for external mold-releasing sheets or vacuum devices. The system serves its own releasing function through the integrated structure.
2Reliability
If through holes are formed in the cavity and vacuum processing is applied to make the mold-releasing sheet adhere, then the reliability of sealing is improved, but the device complexity and cost increase due to additional equipment and process steps
Solution Approach 1:
The invention removes the vacuum processing step and through hole formation from the manufacturing process. The releasing structure achieves reliable sealing and easy removal without requiring vacuum equipment or complex hole formation processes.
Solution Approach 2:
The releasing structure acts as an intermediary mechanism between the cavity and the sealed substrate, providing both reliable sealing during manufacturing and easy removal afterward, without requiring vacuum processing or through holes.
3Reliability
If a case is used to accommodate the semiconductor chips and substrate, then the protection and enclosure are improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The invention merges the cavity structure with the housing function. Instead of using a separate case to accommodate the semiconductor chips and substrate, the cavity itself is designed to provide both the housing space and the sealing function, eliminating the need for an additional case structure.
Solution Approach 2:
The cavity structure performs multiple functions: it provides housing space for the semiconductor components, acts as a seal when combined with the sealing material, and includes a releasing structure for easy removal. This multi-functional design eliminates the need for separate case and sealing components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the cost-effective manufacturing of semiconductor devices without the need for a case or vacuum steps, enabling precise formation of the exterior member and reducing the requirement for additional adhesive materials.
Implementation Method 1
an exterior member (50) having a bottom surface bonded to the front surface of the substrate
Data Source
AI summary
A semiconductor device, including a substrate having a mounting area on a front surface thereof, a semiconductor chip disposed in the mounting area, and an exterior member having a bottom surface bonded to the front surface of the substrate, the exterior member continuously surrounding the mounting area in a loop shape in a plan view of the semiconductor device, to thereby enclose a housing space, the mounting area being in the housing space. The semiconductor device further includes a sealing material sealing the housing space.