Semiconductor Package Failure Detection Using X-Ray and Thermal Analysis
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Solution Overview
Problem
Current test apparatuses for semiconductor packages face challenges in accurately and efficiently detecting failure positions, particularly in identifying open or short circuits in signal lines of the package substrate or semiconductor chips, which hampers timely diagnosis and repair.
Innovation Solution
A test apparatus comprising an X-ray analyzer to acquire and process X-ray images for thickness detection and a thermal reaction analyzer to apply voltages and detect failure positions using surface temperature and thermal diffusion coefficients, enabling precise identification of vertical and horizontal coordinates of failures within the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional test apparatuses are used to detect failure positions in semiconductor packages, then the detection process can be performed, but the accuracy of detecting failure positions is insufficient and detection time is prolonged
Solution Approach 1:
The patent combines X-ray imaging technology and thermal analysis technology into a single integrated test apparatus. The X-ray analyzer captures images to identify structural defects and locate failure positions, while the thermal analysis unit simultaneously performs thermal reactions and measures temperature changes. This merging of two independent detection methods enables the system to achieve high detection accuracy while reducing overall detection time, as both analyses proceed in parallel rather than sequentially.
2Measurement precision
If multiple analysis methods are combined to improve detection accuracy, then failure position detection precision improves, but device complexity increases
Solution Approach 1:
The test apparatus is designed as a multi-functional integrated system where the X-ray analyzer and thermal analysis unit work together within a single device framework. The controller coordinates both analysis methods, allowing the apparatus to perform multiple detection functions (structural analysis via X-ray and thermal property analysis via thermal reactions) without requiring separate independent systems. This multi-functionality approach improves detection accuracy while managing device complexity through integrated design.
Solution Approach 2:
The test apparatus is divided into distinct functional modules: an X-ray analyzer unit for structural imaging and defect detection, a thermal analysis unit for thermal reaction testing and temperature measurement, and a controller for coordinating operations. This segmentation allows each module to specialize in its specific detection function, improving overall accuracy while maintaining manageable complexity through modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for accurate and rapid detection of failure positions in semiconductor packages, reducing analysis time and enhancing diagnostic efficiency by combining X-ray imaging with thermal analysis to pinpoint defects within the package.
Implementation Method 1
an X-ray analyzer configured to acquire an X-ray image of the semiconductor package and detect a thickness of the semiconductor package from the X-ray image
Implementation Method 2
an infrared scope configured to acquire a thermographic image on a surface of the semiconductor package, and a failure detector configured to detect the surface temperature of the semiconductor package from the thermographic image
Implementation Method 3
a failure detector configured to detect vertical coordinates of the failure position using a phase difference between the voltages applied to the semiconductor package and the surface temperature of the semiconductor package
Data Source
AI summary
A test apparatus for a semiconductor package comprising an X-ray analyzer acquiring an X-ray image of the semiconductor package and detecting a thickness of the semiconductor package from the X-ray image, and a thermal reaction analyzer applying a voltage to the semiconductor package and detecting a failure position of the semiconductor package using a surface temperature of the semiconductor package and the thickness of the semiconductor package may be provided.