Semiconductor Failure Analysis Across Multiple Inspection Stages

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Solution Overview

Problem

Existing failure analysis systems for semiconductor devices lack the capability for integrative analysis across multiple inspection processes, leading to inefficiencies in analyzing normal/failure information in block and column units.

Innovation Solution

A failure analysis system that includes a memory for storing normal/failure information, a failure information management table that adds product, fabricating, process, and test information, and an analyzing unit that integrates analysis across multiple inspection processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If separate analysis is performed for each inspection process, then analysis simplicity is maintained, but analysis efficiency and comprehensiveness deteriorate

Engineering Contradiction:
Improveanalysis efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges multiple inspection process analyses into a single integrated failure analysis system. The system collects normal/failure information from multiple inspection processes (pre-process, post-process, and final inspection) and performs unified analysis, thereby improving analysis efficiency and comprehensiveness without significantly increasing system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The failure analysis system is designed with multi-functionality to handle various inspection processes uniformly. It can analyze normal/failure information from different inspection stages (pre-process, post-process, final inspection) using the same analytical framework, making the system versatile and efficient across multiple inspection contexts.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If detailed normal/failure information is collected from multiple inspection processes, then analysis accuracy is improved, but data processing complexity increases

Engineering Contradiction:
Improveanalysis accuracyVSAvoiddata processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the collected normal/failure information into structured categories corresponding to different inspection processes (pre-process, post-process, final inspection). This segmentation allows the system to maintain high analysis accuracy by preserving detailed information while managing data processing complexity through organized, modular data structures.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12235770B2Failure analysis system of semiconductor device, failure analysis method of semiconductor device, and non-transitory computer readable medium
Publication Date: 2025.02.25 KIOXIA CORP
  • US12235770B2 patent drawing
  • US12235770B2 patent drawing
  • US12235770B2 patent drawing

AI summary

According to one embodiment, the failure analysis system of the semiconductor device includes a memory, a failure information management table, and an analyzing unit. The memory stores normal/failure information collected in a block unit and a column unit in a chip, in a plurality of inspection processes of the semiconductor memory. The failure information management table stores the normal/failure information in the block unit and the column unit stored in the memory, with an addition of product information, fabricating information including a lot number, a wafer number, and a chip address, process information, and test information, which are common information ranging over the inspection processes. The analyzing unit analyzes the normal/failure information in the block unit and the column unit ranging over the plurality of inspection processes, on the basis of the information stored in the failure information management table.