Semiconductor Package Fan Placement Zone for Heat Dissipation
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Solution Overview
Problem
Existing cooling fans in semiconductor packages face issues with overheating due to the placement of control chips, which affects heat dissipation and increases the overall thickness and noise levels, making them unsuitable for thin electronics.
Innovation Solution
A semiconductor package design that integrates the fan unit and electronic components on a substrate, allowing the control chip to be positioned outside the fan placement zone, eliminating the need for a housing and enabling efficient airflow without interference, thus reducing the overall thickness and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the control chip is positioned in the gap between the base of the housing and the wheel hub of the fan wheel, then the control chip can be integrated into the cooling fan structure, but the heat generated by the control chip cannot be dissipated due to the narrow gap, resulting in overheat and failure
Solution Approach 1:
The control chip is extracted from the narrow gap between the base and wheel hub, and repositioned on the outer side of the housing base where it has access to cooling airflow. This separates the control chip from the heat-trapping confined space while maintaining its functional integration with the fan system.
Solution Approach 2:
The control chip is relocated from a two-dimensional plane (the gap between base and wheel hub) to a three-dimensional position on the outer surface of the housing base, allowing it to be positioned in a region with better thermal access to the external environment and airflow paths.
2Area of stationary object
If the printed circuit board area is increased to accommodate the control chip, then the control chip can be properly positioned, but the area of the blade must be decreased, affecting wind generation and heat dissipation effect
Solution Approach 1:
The control chip and its supporting circuit board area are relocated to the outer side of the housing base, utilizing the vertical and lateral space outside the traditional fan assembly footprint. This allows the blade area to remain maximized within the fan wheel while the control electronics are positioned in a different spatial zone that does not compete for the same area.
3Length of stationary object
If the height of the gap is increased to accommodate the control chip thickness, then the control chip can be positioned, but the overall height of the cooling fan increases, making it unsuitable for thin electronics
Solution Approach 1:
The control chip is extracted from the vertical gap between the base and wheel hub, eliminating the need to increase gap height to accommodate it. The chip is repositioned on the outer side of the base where it does not contribute to the overall height of the fan assembly, thereby maintaining a compact profile suitable for thin electronics.
4Strength
If a housing is provided to surround the fan wheel and base, then the structural integrity is maintained, but the control chip placement creates interference with airflow and increases complexity
Solution Approach 1:
The housing base is designed to serve multiple functions: it provides structural support for the fan wheel, acts as a mounting platform for the control chip on its outer surface, and serves as part of the airflow path. This multi-functional design eliminates the need for separate housing structures while maintaining structural integrity and reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, reduces the overall thickness of the cooling fan, and minimizes noise, making it suitable for thin electronics while maintaining effective wind output and cooling performance.
Implementation Method 1
a stator (231) surrounding the shaft pillar (2303), wherein the fan wheel (2300) is driven to rotate by a magnetic field generated by the magnet (2301) and the stator (231)
Implementation Method 2
an encapsulant (22) formed on the electronic component (21) and the first surface (20a) of the substrate (20) so as to cover the electronic component (21), the encapsulant (22) having an encapsulant opening (221) exposing the fan placement zone (K)
Implementation Method 3
a fan unit (23) disposed in the encapsulant opening (221) so as to dissipate heat generated by the electronic component (21) to a region outside of the semiconductor package (1) through the encapsulant opening (221)
Data Source
AI summary
A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.