Semiconductor Device Fastener Beam Attachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices with a copper-base-less design face challenges such as increased thermal resistance, external dimensions, and manufacturing costs due to screw-based attachment methods, which require torque management and result in inconsistent warping and reduced adhesion to coolers.
Innovation Solution
A semiconductor device design featuring a terminal case with a beam portion and a fastener having a post shape, where the fastener's leading end is inserted into an attachment hole of the cooler, allowing the beam portion to distort and be filled with sealing resin, thereby enhancing adhesion and reducing thermal resistance and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screw-based attachment methods are used to attach the semiconductor device to the cooler, then the device can be securely fixed, but torque management becomes complex and manufacturing costs increase
Solution Approach 1:
The patent extracts the complex torque management requirement from the attachment process by replacing screw-based attachment with a simplified mechanical interlocking system. The case includes protrusions that fit into recesses on the cooler, eliminating the need for torque-controlled screw tightening while maintaining secure attachment.
Solution Approach 2:
The attachment structure is designed to be self-aligning and self-securing. The protrusions on the case automatically engage with the recesses on the cooler during assembly, providing inherent positioning and fixation without requiring external torque management or complex fastening procedures.
2Ease of operation
If screw portions are positioned at the outer circumference of the case for attachment, then the attachment is simplified, but the external dimensions of the semiconductor device increase
Solution Approach 1:
The attachment protrusions are nested within the case structure itself, integrating the fastening mechanism into the case body rather than adding external screw portions. This nesting approach maintains compact external dimensions while providing simple attachment through the protrusion-recess interlocking system.
3Device complexity
If the insulating substrate is not divided and the back side conductor surface is used for attachment, then the structure is simplified, but warping occurs and adhesion to the cooler is reduced
Solution Approach 1:
The patent divides the insulating substrate into multiple segments or sections, allowing the back side conductor surface to be segmented as well. This segmentation prevents warping by distributing thermal and mechanical stresses across multiple smaller areas, maintaining flatness and ensuring consistent adhesion to the cooler while keeping the overall structure relatively simple.
4Reliability
If thermal grease is applied to compensate for warping and improve adhesion, then contact thermal resistance is reduced, but the amount of thermal grease increases and thermal resistance increases
Solution Approach 1:
The patent performs preliminary action by preventing warping through substrate segmentation before the attachment process. By maintaining a flat back side conductor surface through design, the need for compensatory thermal grease application is eliminated, avoiding the increased thermal resistance that would result from excessive grease usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved adhesion to coolers, reduces contact thermal resistance, and simplifies the attachment process by eliminating the need for torque management, resulting in a more cost-effective and compact semiconductor device.
Implementation Method 1
a fastener that has a post shape, is provided at the center of the beam portion, and has a leading end which is inserted into an attachment hole of the cooler attached to the case such that the beam portion is distorted
Implementation Method 2
The sealing resin fills the case so as to come into contact with the plurality of insulating substrates with a conductive pattern and the beam portion
Implementation Method 3
a cooler that comes into contact with the exposed main surface of each of the plurality of insulating substrates with a conductive pattern
Data Source
AI summary
A semiconductor device includes a terminal case, a beam portion which has elasticity and is connected to the terminal case, divided insulating substrates with a conductive pattern, a fastener which is disposed at the center of the terminal case, and an elastic sealing resin which fills the terminal case.