Stackable Semiconductor Package with Conductive Feed-Throughs

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Solution Overview

Problem

There is a need for effective electrical connectivity between stacked semiconductor devices, particularly for high system integration, where conductive feedthroughs from the top surface to the bottom surface are required to facilitate electrical connections and heat dissipation.

Innovation Solution

The implementation of a molding compound layer with through holes extending from one surface to the other, lined with a second electrically conductive layer and filled with solder material or other conductive materials, along with a redistribution layer system that includes multiple conductive and dielectric layers for efficient electrical coupling and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If through holes are created in the molding compound layer for electrical connectivity, then electrical connection between stacked devices is improved, but structural integrity and insulation may be compromised

Engineering Contradiction:

Improveelectrical connectionVSAvoidstructural integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The through holes are segmented into multiple sections: an upper portion extending from the first surface, a lower portion extending from the second surface, and these portions are electrically connected through conductive material filling. This segmentation allows the molding compound to maintain structural integrity while achieving electrical connectivity through coordinated multi-step processing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Conductive material acts as an intermediary substance that fills the through holes and provides electrical connection between the upper and lower portions. The molding compound serves as an intermediary structure that maintains mechanical strength while accommodating the through holes, resolving the conflict between structural integrity and electrical connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If multiple conductive and dielectric layers are added for redistribution and heat management, then electrical coupling and heat dissipation are improved, but device complexity increases

Engineering Contradiction:

Improveelectrical couplingVSAvoidlayer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple functions are merged into a single integrated structure: the redistribution layer system simultaneously provides electrical coupling between contact pads and through holes, thermal management through heat dissipation paths, and mechanical support. The dielectric layers and conductive layers are combined in an alternating pattern that achieves multiple objectives without proportionally increasing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molding compound layer serves multiple universal functions: it provides mechanical protection, electrical insulation, structural support, and thermal management. The through holes serve dual purposes of electrical connectivity and potential thermal pathways, reducing the need for separate dedicated components and simplifying the overall device architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable electrical connections between stacked devices, supports high system integration, and effectively dissipates heat generated by semiconductor chips, allowing for increased spacing and number of external contact pads while maintaining reduced stacking height.

Implementation Method 1

lined with a second electrically conductive layer and filled with solder material or other conductive materials

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

redistribution layer system that includes multiple conductive and dielectric layers for efficient electrical coupling

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

effectively dissipates heat generated by semiconductor chips

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8829663B2Stackable semiconductor package with encapsulant and electrically conductive feed-through

Publication Date: 2014.09.09 INFINEON TECHNOLOGIES AG

AI summary

A description is given of a device comprising a first semiconductor chip, a molding compound layer embedding the first semiconductor chip, a first electrically conductive layer applied to the molding compound layer, a through hole arranged in the molding compound layer, and a solder material filling the through hole.