Semiconductor Chip Mounting Using Fibrous Material Sheet
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Solution Overview
Problem
Conventional methods for mounting semiconductor chips on substrates, such as die bonding agents, often result in uneven distribution and displacement of the chip during heating and bonding, leading to reliability issues and defects in semiconductor devices, especially in high-voltage power applications.
Innovation Solution
A method involving a fibrous material sheet with a fusible metal bonding layer is used, where the fibrous material sheet is temporarily bonded to the substrate and the fusible metal layer is alloyed with the chip's back surface, ensuring accurate alignment and increased melting point, thereby preventing chip displacement and enhancing thermal reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die bonding agents are used to mount semiconductor chips on substrates, then the bonding process can be completed, but the chip distribution becomes uneven and displacement occurs during heating and bonding
Solution Approach 1:
A fibrous material sheet is introduced as an intermediary between the substrate and the semiconductor chip. This sheet has a melting point higher than the bonding process temperature, allowing it to maintain structural integrity during bonding while providing a stable mounting surface that prevents chip displacement and rotation. The fibrous structure distributes thermal and mechanical stresses uniformly, ensuring precise chip positioning throughout the bonding process.
Solution Approach 2:
The invention changes the temperature parameter relationship by selecting a fibrous material with a melting point significantly higher than the bonding process temperature. This parameter differentiation allows the fibrous sheet to remain solid and structurally stable during the bonding heating process, providing mechanical support and positioning stability that prevents chip displacement while still allowing the bonding agent to function effectively.
2Device complexity
If conventional bonding methods are used, then the bonding process is simple, but stress from thermal expansion differences causes reliability issues
Solution Approach 1:
The invention uses a composite structure consisting of a fibrous material sheet combined with a bonding agent. The fibrous material provides thermal stress resistance and dimensional stability, while the bonding agent ensures strong adhesion between the chip and substrate. This composite approach addresses thermal expansion differences by combining materials with complementary properties, maintaining reliability without significantly increasing process complexity.
3Reliability
If the bonding layer melting point is increased to prevent displacement, then chip stability improves, but the bonding process becomes more difficult
Solution Approach 1:
The bonding system is segmented into two distinct functional layers: a fibrous material sheet with high melting point for structural stability and displacement prevention, and a bonding agent with appropriate melting characteristics for easy application and bonding. This segmentation allows each layer to be optimized independently - the fibrous sheet provides thermal stability without interfering with the bonding process, while the bonding agent maintains ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents chip displacement and rotation during bonding, increases the melting point of the bonding layer, and reduces stress from thermal expansion differences, resulting in high-reliability semiconductor devices with improved heat dissipation and reduced defects.
Implementation Method 1
forming a bonding layer containing a fusible metal on the semiconductor chip-mounting region... bonding the semiconductor chip to the semiconductor chip-mounting region with the fusible metal-containing bonding layer by heating
Implementation Method 2
the fusible metal layer is alloyed with the chip's back surface
Implementation Method 3
a sheet containing a fibrous material having at least one outer surface having a metal... improved heat dissipation
Data Source
AI summary
A method for manufacturing a semiconductor device includes placing a sheet containing a fibrous material having at least one outer surface having a metal on a semiconductor chip-mounting region of a substrate; forming a bonding layer containing a fusible metal on the semiconductor chip-mounting region; placing a semiconductor chip on the semiconductor chip-mounting region; and bonding the semiconductor chip to the semiconductor chip-mounting region with the fusible metal-containing bonding layer by heating.