Semiconductor Package Filler Particle Size Control
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Solution Overview
Problem
High precision analog semiconductor devices experience reduced precision due to packaging stresses caused by large filler particles in the mold compound, leading to increased parametric distributions and limited specification narrowness.
Innovation Solution
Using a mold compound with filler particles sized between 5 microns and 50 microns, with a maximum size of 32 microns, and a stress buffer layer to reduce stress-induced variations on the semiconductor substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If large filler particles are used in the mold compound, then the mechanical strength and structural support are improved, but the local stress variations increase causing reduced precision of analog devices
Solution Approach 1:
The patent applies parameter changes by modifying the filler particle size parameter from conventional large sizes (typically >50 microns) to a controlled range of 5-32 microns. This parameter optimization resolves the contradiction by maintaining sufficient mechanical strength while reducing local stress variations that cause precision degradation in analog devices.
Solution Approach 2:
The patent uses composite materials by combining resin with specifically sized filler particles (5-32 microns) to create a mold compound that balances mechanical support properties with stress distribution characteristics. This composite approach allows simultaneous achievement of structural integrity and reduced parametric distribution in precision analog devices.
2Strength
If large filler particles are used in the mold compound, then the packaging structure is strengthened, but the parametric distributions (offset voltages, reference voltages) increase
Solution Approach 1:
The patent changes the particle size parameter to 5-32 microns, which optimizes the balance between packaging structure strength and electrical parametric stability. This parameter adjustment reduces stress-induced variations in offset voltages and reference voltages while maintaining adequate mechanical support.
3Manufacturing precision
If filler particle size is reduced to improve precision, then the local stress variations are reduced, but the mechanical support capability may be compromised
Solution Approach 1:
The patent identifies an optimal parameter range (5-32 microns) that resolves the contradiction between precision and mechanical support. This parameter optimization ensures that particles are small enough to reduce stress variations but large enough to provide adequate mechanical reinforcement to the mold compound.
Solution Approach 2:
The patent applies local quality by ensuring uniform distribution of specifically sized filler particles throughout the mold compound. This uniform local distribution prevents stress concentration points while maintaining overall structural integrity, thereby supporting both precision requirements and mechanical strength.
Data Source
AI summary
A semiconductor package includes an integrated circuit formed on a semiconductor substrate. A stress buffer layer is provided on the integrated circuit. Further, a mold compound is provided on a surface of the stress buffer layer opposite the integrated circuit. The mold compound comprises a resin. The resin includes filler particles. The filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns.