Semiconductor Chip Fillet Formation for Sink Mark Suppression
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Solution Overview
Problem
The existing manufacturing methods for semiconductor devices often result in the formation of sink marks between the circuit substrate and the semiconductor chip, leading to chip damage and degradation due to resin intrusion, and potential chip separation issues during sealing.
Innovation Solution
A method involving the application of a fillet-forming material using an ink-jet method to form a bonding layer on the semiconductor chip's back face, which is then bonded to a substrate, creating a fillet that fills sink marks and prevents resin intrusion, thereby enhancing the bonding process and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used to bond semiconductor chips to substrates, then the manufacturing process is simple and cost-effective, but sink marks are formed between the chip and substrate leading to resin intrusion and chip damage
Solution Approach 1:
The patent applies preliminary action by forming a protrusion on the bonding surface of the semiconductor chip before the bonding process. This protrusion pre-fills the space that would otherwise become a sink mark, preventing resin intrusion and chip damage during subsequent molding operations.
Solution Approach 2:
The patent converts the harmful effect of potential sink marks into a benefit by intentionally creating a protrusion that occupies the sink mark space. The material removed to create the protrusion is used to fill the void, transforming the potential defect into a protective feature that prevents resin intrusion.
2Reliability
If high pressure resin is used during sealing process, then the sealing effectiveness is improved, but chip separation occurs due to resin entering sink marks
Solution Approach 1:
The protrusion is formed in advance on the chip bonding surface to preemptively occupy the space where sink marks would form during high-pressure sealing. This prevents resin from penetrating into gaps that would compromise bonding strength while allowing effective sealing.
Solution Approach 2:
The protrusion serves as a preliminary anti-action by preventing resin intrusion before the high-pressure sealing process occurs. The protrusion physically blocks the resin from entering potential sink mark regions, thereby preventing chip separation while maintaining sealing effectiveness.
3Ease of manufacture
If conventional bonding without protrusion formation is used, then the manufacturing process is simpler, but gaps form between chip and substrate allowing resin intrusion
Solution Approach 1:
The protrusion formation is integrated into the chip manufacturing process before bonding, ensuring uniform bonding contact without requiring complex post-bonding adjustments. This maintains manufacturing simplicity while achieving superior bonding uniformity by preventing gap formation.
Solution Approach 2:
The patent applies local quality by creating a protrusion at the specific location where sink marks are most likely to form (typically at the edges or corners of the bonding surface). This localized modification improves bonding uniformity without requiring changes to the entire bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the formation of sink marks and reduces the likelihood of chip separation, improving the reliability and integrity of the semiconductor device by ensuring a tight seal without gaps and minimizing resin intrusion.
Implementation Method 1
applying a fillet-forming material to a portion contacting an outer edge of the second major surface of the semiconductor chip on a front face of a substrate
Data Source
AI summary
According to one embodiment, a method is disclosed for manufacturing a semiconductor device including a semiconductor chip having electrode pads formed on a first major surface and a bonding layer provided on a second major surface, and a substrate having the semiconductor chip mounted on the substrate. The manufacturing method can include applying a fillet-forming material to a portion contacting an outer edge of the second major surface of the semiconductor chip on a front face of the substrate. The method can include bonding the second major surface of the semiconductor chip to the substrate via the bonding layer.