Semiconductor Film Composition for Smooth Crosslinked Coatings
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Solution Overview
Problem
Conventional methods for applying polymer compositions to semiconductor members result in films with aggregates and pits, leading to insufficient smoothness due to aggregation and unevenness, which complicates the manufacturing process and affects film uniformity.
Innovation Solution
A semiconductor film composition comprising a compound with a Si—O bond and cationic functional groups, a crosslinking agent with specific —C(═O)OX groups, and a polar solvent, which are mixed and applied to a substrate, then heated to form a smooth and uniform film, reducing aggregates and pits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polymer composition containing polyethyleneimine and polyvalent carboxylic acid is applied to a member, then crosslinking can be achieved, but the polymer and carboxylic acid aggregate causing cloudiness and film unevenness
Solution Approach 1:
A silane compound is introduced as an intermediary between the polyethyleneimine polymer and polyvalent carboxylic acid crosslinking agent. The silane compound first reacts with the carboxylic acid to form a silane carboxylate intermediate, which then reacts with the polymer's amino groups to form crosslinks. This stepwise reaction prevents direct aggregation between polymer and crosslinking agent, maintaining solution clarity and film smoothness while achieving effective crosslinking.
2Reliability
If multiple processing steps are used for applying polymer composition and crosslinking agent separately, then crosslinking can be achieved, but the number of steps increases complicating the manufacturing process
Solution Approach 1:
The patent combines the application of polymer composition and crosslinking agent into a single coating step. The silane compound is mixed with the polyethyleneimine polymer to form a unified composition that is applied to the member in one operation. Subsequent heating simultaneously completes both the silane-carboxylic acid reaction and the crosslinking reaction, reducing the process from multiple separate steps to a single application step followed by one heating treatment.
3Ease of manufacture
If polymer and crosslinking agent are mixed to prepare composition, then application can be simplified, but aggregation occurs causing cloudiness and film defects
Solution Approach 1:
The silane compound is preliminarily mixed with the polyethyleneimine polymer to form a stable composition before application. This preliminary mixing creates a homogeneous solution where the silane acts as a protective intermediary, preventing direct interaction and aggregation between the polymer and crosslinking agent. The composition remains clear and uniform during storage and application, and only upon heating does the crosslinking reaction proceed, ensuring film uniformity while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of films with high smoothness and uniformity, improving the manufacturing process by reducing aggregates and pits, and enhancing film thickness consistency across large substrates.
Implementation Method 1
a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(═O)OX groups
Data Source
AI summary
Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).