Semiconductor Package Nonconductive Film Tail Control
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Solution Overview
Problem
In semiconductor packages, the irregular shapes of nonconductive film tail portions formed during the bonding process can lead to structural instability and electrical reliability issues due to voids, contamination, and cracks, caused by nonuniform cross-sectional profiles and merging tail portions.
Innovation Solution
The semiconductor package design includes recessed or hollow portions on the semiconductor chips to control the shape of the nonconductive film tail portions, ensuring they are bent in a consistent direction, such as towards the package substrate, thereby stabilizing the structure and improving electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a nonconductive film is used to fill spaces between stacked semiconductor chips, then structural stability is improved, but irregular tail portions cause voids, contamination, and cracks that reduce electrical reliability
Solution Approach 1:
The patent forms recessed portions in the semiconductor chips before bonding the nonconductive film. This preliminary structural modification guides the nonconductive film to form uniform tail portions during the bonding process, preventing irregular shapes that would cause voids and cracks, thereby maintaining electrical reliability while preserving structural stability
Solution Approach 2:
The patent introduces recessed portions at specific locations (edge portions) of the semiconductor chips where the nonconductive film tail portions form. This local structural modification ensures uniform film distribution and controlled tail portion shapes without affecting the overall chip structure, resolving the contradiction between structural stability and electrical reliability
2Ease of manufacture
If the nonconductive film tail portions are allowed to form naturally during bonding, then the bonding process is simple, but the tail portions have nonuniform cross-sectional profiles that cause merging and defects
Solution Approach 1:
The recessed portions are formed in advance before the bonding process, creating a mold-like structure that guides the nonconductive film to form uniform tail portions. This allows the bonding process itself to remain simple while achieving precise control over tail portion geometry, resolving the contradiction between manufacturing simplicity and precision
3Manufacturing precision
If recessed or hollow portions are added to control nonconductive film tail portions, then manufacturing precision and structural stability are improved, but device complexity increases
Solution Approach 1:
The recessed portions are localized to specific edge regions of the semiconductor chips where they are needed for film control, rather than modifying the entire chip structure. This minimal local modification achieves precise tail portion control while keeping the overall device complexity low
Solution Approach 2:
The recessed portions are formed as discrete, segmented features at the edge portions of the chips, allowing independent formation and control of each recessed region. This segmentation enables precise local control of the nonconductive film without requiring complex global structural changes
Data Source
AI summary
A semiconductor package according to an aspect includes a package substrate, a first semiconductor chip disposed on the package substrate and including a first through electrode, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode, and a nonconductive film disposed in a bonding zone between the first semiconductor chip and the second semiconductor chip. At an edge portion of the bonding zone, an edge portion of the first semiconductor chip is recessed in the lateral direction, based on an edge portion of the second semiconductor chip.