Semiconductor Device With Fixed Control Circuit Terminals
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Solution Overview
Problem
The challenge is to design a semiconductor device with a power transistor circuit and control circuits, such as a PWM circuit, in a single package, which can accommodate various types of loads, ensuring easy wiring pattern design on a substrate without causing control circuit malfunctions due to differing load requirements.
Innovation Solution
The semiconductor device integrates a power transistor circuit and a control circuit, including a PWM circuit, with common external terminals for all devices, allowing for consistent wiring pattern design on the substrate, regardless of load type, by maintaining fixed design conditions for certain components while varying others based on load requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the arrangement of power transistor circuit and control circuit is changed according to load type, then the semiconductor device can accommodate different output voltage, current, and switching frequency requirements, but the external terminal arrangement must be changed which causes wiring pattern redesign and may lead to control circuit malfunction
Solution Approach 1:
The patent applies universality by designing a standardized package structure with fixed external terminal arrangements that can accommodate multiple load types. The control circuit is designed to be load-agnostic, allowing the same package to serve different applications (memory, logic IC, FPGA) without requiring terminal reconfiguration, thus resolving the contradiction between adaptability and design complexity
Solution Approach 2:
The patent segments the semiconductor device into distinct functional modules: power transistor circuit, control circuit, and driver circuit, each with dedicated external terminals. This segmentation allows independent optimization of each module while maintaining a consistent overall terminal arrangement, enabling adaptability to different loads without requiring changes to the external terminal layout
2Adaptability or versatility
If the external terminal arrangement is changed for different load types, then the semiconductor device can meet different electrical requirements, but the wiring pattern on the substrate must be redesigned which increases development time and cost
Solution Approach 1:
By creating a universal package design with standardized terminal assignments, the patent eliminates the need for redesigning wiring patterns when accommodating different load types. The same terminal arrangement works for memory, logic IC, and FPGA applications, significantly reducing development time and eliminating the trade-off between adaptability and development efficiency
3Device complexity
If the control circuit is integrated with power transistor circuit in a single package, then the device becomes more compact and easier to mount, but the wiring pattern design becomes more critical and complex
Solution Approach 1:
The patent applies local quality by optimizing the internal arrangement of control circuit elements based on their specific functional requirements. The PWM circuit, driver circuit, and power transistor are positioned and connected with terminals assigned according to their electrical characteristics, reducing wiring complexity while maintaining compact integration. This localized optimization resolves the contradiction between integration level and wiring design difficulty
Data Source
AI summary
Disclosed is a semiconductor device which makes it easy to design a wiring pattern for a wiring substrate on which the semiconductor device is to be mounted. In manufacturing plural semiconductor devices for providing different amounts of output current, arrangements and numbers of leads to which semiconductor chips for power transistors of the semiconductor devices are to be electrically connected are changed according to output current requirements for the semiconductor devices, whereas arrangements and numbers of leads to which semiconductor chips for control circuits of the semiconductor devices are to be electrically connected are fixed to be common to the semiconductor devices. In this way, the probability of malfunction of control circuits (PWM circuits) of the semiconductor devices can be reduced, so that a semiconductor device which makes it easy to design a wiring pattern for a wiring substrate on which the semiconductor device is to be mounted can be provided.