Semiconductor Package Fixturing Structure for Molding Layer Adhesion
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Solution Overview
Problem
Conventional semiconductor packages face issues with the detachment of the molding layer from the lower semiconductor layer due to the shrinking fixturing region, leading to instability and potential failure.
Innovation Solution
Incorporating a fixturing structure with fixturing holes and protrusions, where the fixturing holes have an expanding portion below the opening, enhancing the adhesive strength between the molding layer and the lower semiconductor layer by providing a stable interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the fixturing region is reduced to enable miniaturization, then the semiconductor device size is reduced, but the molding layer may detach from the lower semiconductor layer
Solution Approach 1:
The invention transitions from a two-dimensional planar attachment interface to a three-dimensional mechanical interlocking structure by forming protrusions that extend into holes. This dimensional change allows the molding layer to be mechanically anchored within the lower semiconductor layer, providing reliable attachment even when the overall fixturing region area is reduced for miniaturization.
Solution Approach 2:
The invention creates localized regions of enhanced attachment strength by forming discrete protrusions at specific positions within the molding layer. Instead of uniformly distributing attachment across the entire interface, the protrusions concentrate adhesive force at critical locations, ensuring reliable bonding while allowing the overall device size to be reduced.
2Volume of moving object
If the fixturing region is reduced for miniaturization, then device size decreases, but the adhesive strength between molding layer and lower semiconductor layer deteriorates
Solution Approach 1:
The solution adds a vertical dimension to the attachment mechanism by creating protrusions that extend into holes formed in the lower semiconductor layer. This transforms the attachment from a surface-level bond to a depth-based mechanical interlock, maintaining strength despite reduced planar area.
Solution Approach 2:
The invention creates a composite structure where the molding layer and lower semiconductor layer are mechanically integrated through protrusions. This composite arrangement combines the structural support of the semiconductor layer with the protective molding layer, achieving both miniaturization and maintained adhesive strength.
Data Source
AI summary
The present disclosure relates to a semiconductor package and a method for preparing the same. The semiconductor package includes a lower semiconductor layer, an upper semiconductor layer, a fixturing structure, and a molding layer. The lower semiconductor layer includes an attached region and a fixturing region adjacent to the attached region. The upper semiconductor layer is disposed over the attached region. The fixturing structure is disposed adjacent to the upper semiconductor layer. The fixturing structure has at least one fixturing hole, the fixturing hole has an opening corresponding to the fixturing region, and the opening has a first width. The molding layer covers side walls of the upper semiconductor layer. The molding layer has at least one fixturing protrusion extending into the fixturing hole, the fixturing protrusion has a first expanding portion below the opening, and the first expanding portion has a second width greater than the first width.